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Category: Dicing Saws

Dicing Saws

Showing all 11 results

  • AG6800

    $45,000.00

    6-8 inch fully-automatic grinding equipment

    Applications

    It is mainly used for fully-automatic grinding of 4-8 inch semiconductor
    wafers. Suitable for specific semiconductors and other materials.

    Features

    • In-feed grinding mode.
    • Precision imported ball crew, linear slider, Z-direction precision control,
      high-precision machine for a long time.
    • Double spindle, three working discs, high processing efficiency.
    • Full-automatic loading and unloading, transmission and positioning,
      cleaning and drying, realize the fully automatic operation mode, and
      greatly reduce the workload of Op.
    • Ultra-thin thinning and stable processing.
    • Good compatibility, high compatibility with other types of equipment
      and key consumables on the market.
    • Convenient operation and human-computer interaction interface.
    Add to cart
  • AR3000

    $38,645.00

    4-6 inch single axle semi-automatic

    Applications

    It is mainly used for cutting 6-inch semiconductor wafers, integrated circuits,
    QFN, light-emitting diodes, LED chips, solar cells, electronic substrates,
    piezoelectric ceramics, etc; Suitable for materials including silicon, quartz,
    alumina, iron oxide, gallium arsenide, lithium niobate, sapphire and glass.

    Features

    • Touch teaching GUI, simulation display of editing process, simple and
      convenient operation.
    • Precision imported ball-bearing leadscrew, linear slider, Y-direction
      grating ruler closed-loop control, high-precision machine for a long
      time.
    • Direct light and circular light sources, 70 ×— 320 × Optional
      magnification double microscope, the workpiece is clearly displayed.
    • Real time display of blade exposure, self inspection alarm of height
      measurement system, vacuum early warning, and real-time
      controllable processing state.
    • Automatic alignment, automatic cutting and automatic tool mark
      detection functions reduce the workload of operators and effectively
      improve production efficiency.
    Add to cart
  • AR6000

    $54,798.00

    6-8 inch single axle semi-automatic

    Applications

    It is mainly used for cutting 6-8 inch semiconductor wafers, integrated
    circuits, light-emitting diodes, LED chips, solar cells, electronic
    substrates, piezoelectric ceramics, etc; Suitable for materials including
    silicon, quartz, alumina, iron oxide, gallium arsenide, lithium niobate,
    sapphire and glass.

    Features

    • The 8-inch equipment with outstanding floor area ratio has an effective
      processing range of 8-inch wafers.
    • Touch teaching GUI, simulation display of editing process, simple and
      convenient operation.
    • Precision imported ball-bearing leadscrew, linear slider, Y-direction
      grating ruler closed-loop control, high-precision machine for a long
      time.
    • Direct light and circular light sources, 70 ×— 320 × Optional
      magnification double microscope, clear workpiece display.
    • Real time display of blade exposure, self inspection alarm of height
      measurement system, vacuum early warning, and real-time controllable
      processing state.
    • Automatic alignment, automatic cutting and automatic knife mark
      detection functions reduce the workload of operators and effectively
      improve production efficiency.
    Add to cart
  • AR7000

    $64,789.00

    8-12 inch precision automatic dicing saw

    Applications

    It is mainly used for cutting 8-12 inch semiconductor wafer, integrated circuit,
    QFN, DFN, BGA, multi chip led-pcb frame, optical communication devices and
    other fields; Suitable for various materials including silicon, quartz glass, alumina,
    ceramics, PCB board or package frame.

    Features

    • Precision imported Ball-bearing leadscrew, linear guide, Y-direction grating
      ruler closed-loop control, high-precision machine for a long time.
    • It is matched with a variety of imported air spindles (compatible with the
      common short shafts in the market at present), and can be equipped with
      2.4kw high-power and high torque spindles.
    • Direct light and ring light sources, 70 ×— 320 × Optional magnification
      double microscope, wide process application range.
    • Special cutting frame and worktable can be customized to cut multiple
      pieces efficiently.
    • Touch teaching GUI, simulation display of editing process, multi slice pre
      cutting mode, simple and convenient program editing.
    • Automatic alignment, automatic cutting and automatic knife mark detection
      functions reduce the workload of operators and effectively improve
      production efficiency.
    Add to cart
  • AR8000

    $75,440.00

    12 inch semi-automatic

    Applications

    It is mainly used for cutting 8-12 inch semiconductor wafer, integrated circuit,
    QFN, DFN, BGA, multi chip led-pcb frame, optical communication devices and
    other fields; Suitable for various materials including silicon, quartz glass, alumina,
    ceramics, PCB board or package frame.

    Features

    • Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
      higher than that of single machine.
    • Precision imported ball-bearing leadscrew, linear slider, Y-direction grating ruler closed loop control, high-precision machine for a long time.
    • The main shaft is equipped with a gantry worktable structure, and the distance between twoknives is at least 24mm. The dual axis cutting process has a wider application range.
    • Special cutting frame and worktable can be customized, and multiple pieces of double
      knives can be cut efficiently.
    • Optional magnification double microscope vision system, wide process adaptability.
    • Touch teaching GUI, simulation display of editing process, multi slice pre cutting mode,
      simple and convenient program editing.
    • Automatic alignment, automatic cutting and automatic knife mark detection functions
      reduce the workload of operators and effectively improve production efficiency.
    Add to cart
  • AR8100

    $41,000.00

    20 inch double axle semi-automatic

    Applications

    It is mainly used for cutting processing in QFN, DFN, BGA, multi chip led-pcb frame,
    optical communication devices and other fields; Suitable for various materials
    including silicon, quartz glass, alumina, ceramics, PCB board or package frame.

    Features

    • Optimize the double axis high-efficiency cutting mode, and the
      efficiency is about 80% higher than that of single machine.
    • Precision imported ball crew, linear slider, Y-direction grating ruler
      closed-loop control, high-precision machine for a long time.
    • The main shaft is equipped with a gantry worktable structure, and the
      distance between two blades is at least 24mm. The dual axis cutting
      process has a wider application range.
    • Special cutting frame and worktable can be customized, and multiple
      pieces of double blades can be cut efficiently.
    • Touch teaching GUI, simulation display of editing process, multi slice
      pre cutting mode, simple and convenient program editing.
    • Automatic alignment, automatic cutting and automatic tool mark
      detection functions reduce the workload of operators and effectively
      improve production efficiency.
    Add to cart
  • AR8200

    $47,000.00

    AR8200 – Fully Automatic Dicing Saw

    Applications

    It is mainly used for fully-automatic cutting processing in the fields of multi chip QFN, DFN,
    BGA, led-pcb frame, optical communication devices and so on; It is suitable for a variety of
    materials including quartz glass, alumina, ceramics, PCB board or package frame.

    Features

    • Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
      higher than that of single machine.
    • Precision imported ball-bearing leadscrew, linear slider, Y-direction grating ruler
      closed-loop control, high-precision machine for a long time.
    • The main shaft is equipped with a gantry worktable structure, and the distance between
      two knives is at least 24mm. The dual axis cutting process has a wider application range.
    • Fully automatic loading and unloading, automatic transmission and positioning,
      automatic alignment cutting and automatic tool mark detection reduce the workload of
      OP and realize the replacement of machines to a greater extent.
    • Special cutting frame and worktable can be customized, and multiple pieces of double
      knives can be cut efficiently.
    • Direct light and ring light sources, 70 ×—320 × Optional magnification double
      microscope, wide process application range.
    • Touch teaching GUI, simulation display of editing process, multichip wafer pre cutting
      mode, simple and convenient program editing.
    Add to cart
  • AR9000

    $54,800.00

    12 inch double axis fully-automatic

    Applications

    It is mainly used for fully-automatic cutting processing in 8-12 inch semiconductor
    wafer, integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
    communication devices and other fields; Suitable for various materials including silicon,
    quartz glass, alumina, ceramics, PCB board or package frame.

    Features

    • Optimize the double axis high-efficiency cutting mode, and the efficiency is about
      80% higher than that of single machine.
    • Precision imported ball screw, linear slider, Y-direction grating ruler closed-loop
      control, high-precision machine for a long time.
    • The main shaft is equipped with a gantry worktable structure, and the distance
      between two blades is at least 24mm. The dual axis cutting process has a wider
      application range.
    • Fully automatic loading and unloading, transmission and positioning, alignment
      cutting, tool mark detection, cleaning and drying, so as to realize the fully
      automatic operation mode and greatly reduce the workload of Op.
    • The cutting frame and worktable can be customized, and the package and wafer
      dual adaptive interfaces are reserved for convenient and fast conversion.
    • High speed material box frame scanning, anti-collision alarm, high-speed
      transmission and positioning, strong state error correction ability.
    Add to cart
  • AR9000RR

    $75,900.00

    Full-automatic ring cutting equipment Ring cutting + fully-automatic wafer-ring removal

    Applications

    It is mainly used for fully-automatic outer ring removal of semiconductor wafers
    under Taiko process. Suitable for specific semiconductors and other materials.

    Features

    • Multi axis linkage ring cutting technology to ensure ring cutting accuracy.
    • Customized workbench design ensures stable processing of special wafer
      structure under Taiko process.
    • Four stations, multi piece coordinated processing, high processing efficiency.
    • Full- automatic loading and unloading, transmission and positioning, cleaning,
      degumming and ring removal realize the full-automatic operation mode and
      greatly reduce the workload of Op.
    • Stable Taiko outer ring degumming and ring removal.
    • Good compatibility, high compatibility with other types of equipment and key
      consumables on the market.
    • Convenient operation and human-computer interaction interface
    Add to cart
  • AR9200

    $45,880.00

    Jig saw cutting and sorting integrated machine | Double axis double station fully automatic

    Applications

    It is mainly used for cutting packaging products, such as DFN, QFN, BGA
    and other sealed products.

    Features

    • Dual axis efficient cutting mode, independent vision system can ensure
      alignment and cutting at the same time, which can improve cutting efficiency.
    • Double working platforms work circularly, making full use of various structures
      of the equipment, which can improve the cutting efficiency.
    • Special jig , high vacuum adsorption substrate, no film sticking, reducing the
      process flow and related costs of film sticking and dispergation.
    • It can be equipped with full-automatic feeding, transmission positioning,
      alignment cutting, tool mark detection, cleaning and drying, so as to realize
      the full-automatic operation mode and greatly reduce the labor cost.
    • Equipped with fully-automatic slag removal and collection structure to reduce
      the cost of human maintenance.
    • The cutting and conversion of different products is fast, which can be
      completed by replacing the customized jig.
    Add to cart
  • AR9700

    $45,788.00

    12 inches + (for PKG) Double axis full-automatic cutter

    Applications

    It is mainly used for fully-automatic cutting processing in the fields of 15
    inch integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
    communication devices and so on; Suitable for various materials including
    silicon, quartz glass, alumina, ceramics, PCB board or package frame.

    Features

    • Biaxial cutting can cut larger workpieces and improve efficiency.
    • Precision imported ball crew, linear slider, Y-direction grating ruler closed-loop control,
      high-precision machine for a long time.
    • The main shaft is equipped with a gantry worktable structure, and the distance between
      two blades is at least 24mm. The dual axis cutting process has a wider application range.
    • Full-automatic loading and unloading, transmission and positioning, alignment cutting,
      tool mark detection, cleaning and drying, so as to realize the full-automatic operation
      mode and greatly reduce the workload of Op.
    • The cutting frame and worktable can be customized, and the package and wafer dual
      adaptive interfaces are reserved for convenient and fast conversion.
    • High speed material box frame scanning, anti-collision alarm, high-speed transmission
      and positioning, strong state error correction ability
    Add to cart

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