Cart

Your Cart is Empty

Back To Shop

AR7000

$64,789.00

8-12 inch precision automatic dicing saw

Applications

It is mainly used for cutting 8-12 inch semiconductor wafer, integrated circuit,
QFN, DFN, BGA, multi chip led-pcb frame, optical communication devices and
other fields; Suitable for various materials including silicon, quartz glass, alumina,
ceramics, PCB board or package frame.

Features

  • Precision imported Ball-bearing leadscrew, linear guide, Y-direction grating
    ruler closed-loop control, high-precision machine for a long time.
  • It is matched with a variety of imported air spindles (compatible with the
    common short shafts in the market at present), and can be equipped with
    2.4kw high-power and high torque spindles.
  • Direct light and ring light sources, 70 ×— 320 × Optional magnification
    double microscope, wide process application range.
  • Special cutting frame and worktable can be customized to cut multiple
    pieces efficiently.
  • Touch teaching GUI, simulation display of editing process, multi slice pre
    cutting mode, simple and convenient program editing.
  • Automatic alignment, automatic cutting and automatic knife mark detection
    functions reduce the workload of operators and effectively improve
    production efficiency.

Reviews

There are no reviews yet.

Only logged in customers who have purchased this product may leave a review.

Cart

Your Cart is Empty

Back To Shop