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AR7000
$64,789.00
8-12 inch precision automatic dicing saw
Applications
It is mainly used for cutting 8-12 inch semiconductor wafer, integrated circuit,
QFN, DFN, BGA, multi chip led-pcb frame, optical communication devices and
other fields; Suitable for various materials including silicon, quartz glass, alumina,
ceramics, PCB board or package frame.
Features
- Precision imported Ball-bearing leadscrew, linear guide, Y-direction grating
ruler closed-loop control, high-precision machine for a long time. - It is matched with a variety of imported air spindles (compatible with the
common short shafts in the market at present), and can be equipped with
2.4kw high-power and high torque spindles. - Direct light and ring light sources, 70 ×— 320 × Optional magnification
double microscope, wide process application range. - Special cutting frame and worktable can be customized to cut multiple
pieces efficiently. - Touch teaching GUI, simulation display of editing process, multi slice pre
cutting mode, simple and convenient program editing. - Automatic alignment, automatic cutting and automatic knife mark detection
functions reduce the workload of operators and effectively improve
production efficiency.
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