The HMDS pre-treatment system allows controlled adjustment of parameters such as processing temperature, time, and dwell time, enabling uniform HMDS coating on wafer surfaces. This reduces the contact angle post-HMDS treatment, decreases the required amount of photoresist, and improves adhesion between the photoresist and wafer.
Better Pre-treatment Performance
The system performs HMDS treatment after multiple nitrogen purges, minimizing dust contamination. It combines “dehydration baking” and HMDS treatment in a single process and chamber. Wafers undergo a 100–200°C bake to remove water, followed by HMDS treatment without exposure to the atmosphere, significantly reducing moisture absorption and improving treatment effectiveness.
HMDS is applied as vapor, offering better uniformity than liquid coating.
This system can treat multiple wafer cassettes simultaneously.
The process is fully enclosed, there’s no human contact with the liquid or vapor, ensuring safety. Exhaust vapors are pumped directly to a treatment system, avoiding environmental pollution.
Fully Automatic.
Control: LCD touchscreen + Mitsubishi PLC
Process: Editable, up to 5 programmable recipes
Nitrogen purge: With pressure regulator, automatic valve, and preheating
HMDS Supply: Automatic sealed delivery system with pressure differential
Materials:
All components use medical-grade 316L stainless steel
Suitable for Class 100 cleanroom lithography environments
Piping:
Three 316L stainless steel pipes:
Top & bottom for nitrogen
Middle for HMDS vaporization
Vacuum line
Optional NH₃ line for image reversal
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