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AML Wafer Bonder – Activate, Align and Bond all in one system
$46,500.00
• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface
Related products
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Model 2012
$56,700.00Add to cartModel 2012 – 300mm Optical Edge or Flood Exposure System
• Handles 200 or 300mm wafers (8” -12”)
• Has automated foup loading or cassette to cassette handling
• Up to 8kw Collimated Beam Light Source
• Bar code reader and remote diagnostic
• Semi safety compliant
• Windows graphic user interface
• Remote diagnostics -
Model 32
$7,900.00Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
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Model 30
$7,800.00Add to cartModel 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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AR9000
$54,800.00Add to cart12 inch double axis fully-automatic
Applications
It is mainly used for fully-automatic cutting processing in 8-12 inch semiconductor
wafer, integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
communication devices and other fields; Suitable for various materials including silicon,
quartz glass, alumina, ceramics, PCB board or package frame.Features
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about
80% higher than that of single machine. - Precision imported ball screw, linear slider, Y-direction grating ruler closed-loop
control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance
between two blades is at least 24mm. The dual axis cutting process has a wider
application range. - Fully automatic loading and unloading, transmission and positioning, alignment
cutting, tool mark detection, cleaning and drying, so as to realize the fully
automatic operation mode and greatly reduce the workload of Op. - The cutting frame and worktable can be customized, and the package and wafer
dual adaptive interfaces are reserved for convenient and fast conversion. - High speed material box frame scanning, anti-collision alarm, high-speed
transmission and positioning, strong state error correction ability.
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about
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TS580
$56,895.00Add to cart- Temperature change rate is fast, -55 0C toThe conversion between+ 1 25 0C is about 1 0 seconds
- Temperature range of-80 0 C to +225 0 C
- Compact and mobile design
- Touch screen operation, human-computer interaction interface
- Fast DUT temperature stabilization time
- Temperature control accuracy ± 1 oc, display accuracy ± 0.1 oc
- Air up to 18 SCFM
- Defrosting design, rapid removal of internal water vapor accumulation
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