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  AG6800

  $45,000.00

  6-8 inch fully-automatic grinding equipment

  Applications

  It is mainly used for fully-automatic grinding of 4-8 inch semiconductor
  wafers. Suitable for specific semiconductors and other materials.

  Features

  • In-feed grinding mode.
  • Precision imported ball crew, linear slider, Z-direction precision control,
    high-precision machine for a long time.
  • Double spindle, three working discs, high processing efficiency.
  • Full-automatic loading and unloading, transmission and positioning,
    cleaning and drying, realize the fully automatic operation mode, and
    greatly reduce the workload of Op.
  • Ultra-thin thinning and stable processing.
  • Good compatibility, high compatibility with other types of equipment
    and key consumables on the market.
  • Convenient operation and human-computer interaction interface.

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