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  AR6000

  $54,798.00

  6-8 inch single axle semi-automatic

  Applications

  It is mainly used for cutting 6-8 inch semiconductor wafers, integrated
  circuits, light-emitting diodes, LED chips, solar cells, electronic
  substrates, piezoelectric ceramics, etc; Suitable for materials including
  silicon, quartz, alumina, iron oxide, gallium arsenide, lithium niobate,
  sapphire and glass.

  Features

  • The 8-inch equipment with outstanding floor area ratio has an effective
    processing range of 8-inch wafers.
  • Touch teaching GUI, simulation display of editing process, simple and
    convenient operation.
  • Precision imported ball-bearing leadscrew, linear slider, Y-direction
    grating ruler closed-loop control, high-precision machine for a long
    time.
  • Direct light and circular light sources, 70 ×— 320 × Optional
    magnification double microscope, clear workpiece display.
  • Real time display of blade exposure, self inspection alarm of height
    measurement system, vacuum early warning, and real-time controllable
    processing state.
  • Automatic alignment, automatic cutting and automatic knife mark
    detection functions reduce the workload of operators and effectively
    improve production efficiency.

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