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  AR7000

  $64,789.00

  8-12 inch precision automatic dicing saw

  Applications

  It is mainly used for cutting 8-12 inch semiconductor wafer, integrated circuit,
  QFN, DFN, BGA, multi chip led-pcb frame, optical communication devices and
  other fields; Suitable for various materials including silicon, quartz glass, alumina,
  ceramics, PCB board or package frame.

  Features

  • Precision imported Ball-bearing leadscrew, linear guide, Y-direction grating
    ruler closed-loop control, high-precision machine for a long time.
  • It is matched with a variety of imported air spindles (compatible with the
    common short shafts in the market at present), and can be equipped with
    2.4kw high-power and high torque spindles.
  • Direct light and ring light sources, 70 ×— 320 × Optional magnification
    double microscope, wide process application range.
  • Special cutting frame and worktable can be customized to cut multiple
    pieces efficiently.
  • Touch teaching GUI, simulation display of editing process, multi slice pre
    cutting mode, simple and convenient program editing.
  • Automatic alignment, automatic cutting and automatic knife mark detection
    functions reduce the workload of operators and effectively improve
    production efficiency.

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