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  AR9000

  $54,800.00

  12 inch double axis fully-automatic

  Applications

  It is mainly used for fully-automatic cutting processing in 8-12 inch semiconductor
  wafer, integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
  communication devices and other fields; Suitable for various materials including silicon,
  quartz glass, alumina, ceramics, PCB board or package frame.

  Features

  • Optimize the double axis high-efficiency cutting mode, and the efficiency is about
    80% higher than that of single machine.
  • Precision imported ball screw, linear slider, Y-direction grating ruler closed-loop
    control, high-precision machine for a long time.
  • The main shaft is equipped with a gantry worktable structure, and the distance
    between two blades is at least 24mm. The dual axis cutting process has a wider
    application range.
  • Fully automatic loading and unloading, transmission and positioning, alignment
    cutting, tool mark detection, cleaning and drying, so as to realize the fully
    automatic operation mode and greatly reduce the workload of Op.
  • The cutting frame and worktable can be customized, and the package and wafer
    dual adaptive interfaces are reserved for convenient and fast conversion.
  • High speed material box frame scanning, anti-collision alarm, high-speed
    transmission and positioning, strong state error correction ability.

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