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  AML Wafer Bonder – Activate, Align and Bond all in one system

  $76,800.00 $46,500.00

  • In situ alignment with 1um accuracy
  • Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
  • Eliminates need for external mask aligner
  • Available: Anodic silicon direct and thermal compression
  bond tooling
  • Contact and bonding with forces up to 40KN
  • Autovapor injection
  • Wafers held in separation
  • User interface

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