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AG6800
$45,000.00
6-8 inch fully-automatic grinding equipment
Applications
It is mainly used for fully-automatic grinding of 4-8 inch semiconductor
wafers. Suitable for specific semiconductors and other materials.
Features
- In-feed grinding mode.
- Precision imported ball crew, linear slider, Z-direction precision control,
high-precision machine for a long time. - Double spindle, three working discs, high processing efficiency.
- Full-automatic loading and unloading, transmission and positioning,
cleaning and drying, realize the fully automatic operation mode, and
greatly reduce the workload of Op. - Ultra-thin thinning and stable processing.
- Good compatibility, high compatibility with other types of equipment
and key consumables on the market. - Convenient operation and human-computer interaction interface.
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- Optimize the double axis high-efficiency cutting mode, and the
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AR9000RR
$75,900.00Add to cartFull-automatic ring cutting equipment Ring cutting + fully-automatic wafer-ring removal
Applications
It is mainly used for fully-automatic outer ring removal of semiconductor wafers
under Taiko process. Suitable for specific semiconductors and other materials.Features
- Multi axis linkage ring cutting technology to ensure ring cutting accuracy.
- Customized workbench design ensures stable processing of special wafer
structure under Taiko process. - Four stations, multi piece coordinated processing, high processing efficiency.
- Full- automatic loading and unloading, transmission and positioning, cleaning,
degumming and ring removal realize the full-automatic operation mode and
greatly reduce the workload of Op. - Stable Taiko outer ring degumming and ring removal.
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Model 30
$7,800.00Add to cartModel 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV- Mercury Arc and Mercury Xenon lamps
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- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
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