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AR3000
$38,645.00
4-6 inch single axle semi-automatic
Applications
It is mainly used for cutting 6-inch semiconductor wafers, integrated circuits,
QFN, light-emitting diodes, LED chips, solar cells, electronic substrates,
piezoelectric ceramics, etc; Suitable for materials including silicon, quartz,
alumina, iron oxide, gallium arsenide, lithium niobate, sapphire and glass.
Features
- Touch teaching GUI, simulation display of editing process, simple and
convenient operation. - Precision imported ball-bearing leadscrew, linear slider, Y-direction
grating ruler closed-loop control, high-precision machine for a long
time. - Direct light and circular light sources, 70 ×— 320 × Optional
magnification double microscope, the workpiece is clearly displayed. - Real time display of blade exposure, self inspection alarm of height
measurement system, vacuum early warning, and real-time
controllable processing state. - Automatic alignment, automatic cutting and automatic tool mark
detection functions reduce the workload of operators and effectively
improve production efficiency.
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AR8200
$47,000.00Add to cartAR8200 – Fully Automatic Dicing Saw
Applications
It is mainly used for fully-automatic cutting processing in the fields of multi chip QFN, DFN,
BGA, led-pcb frame, optical communication devices and so on; It is suitable for a variety of
materials including quartz glass, alumina, ceramics, PCB board or package frame.Features
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
higher than that of single machine. - Precision imported ball-bearing leadscrew, linear slider, Y-direction grating ruler
closed-loop control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance between
two knives is at least 24mm. The dual axis cutting process has a wider application range. - Fully automatic loading and unloading, automatic transmission and positioning,
automatic alignment cutting and automatic tool mark detection reduce the workload of
OP and realize the replacement of machines to a greater extent. - Special cutting frame and worktable can be customized, and multiple pieces of double
knives can be cut efficiently. - Direct light and ring light sources, 70 ×—320 × Optional magnification double
microscope, wide process application range. - Touch teaching GUI, simulation display of editing process, multichip wafer pre cutting
mode, simple and convenient program editing.
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
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AR9000
$54,800.00Add to cart12 inch double axis fully-automatic
Applications
It is mainly used for fully-automatic cutting processing in 8-12 inch semiconductor
wafer, integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
communication devices and other fields; Suitable for various materials including silicon,
quartz glass, alumina, ceramics, PCB board or package frame.Features
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about
80% higher than that of single machine. - Precision imported ball screw, linear slider, Y-direction grating ruler closed-loop
control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance
between two blades is at least 24mm. The dual axis cutting process has a wider
application range. - Fully automatic loading and unloading, transmission and positioning, alignment
cutting, tool mark detection, cleaning and drying, so as to realize the fully
automatic operation mode and greatly reduce the workload of Op. - The cutting frame and worktable can be customized, and the package and wafer
dual adaptive interfaces are reserved for convenient and fast conversion. - High speed material box frame scanning, anti-collision alarm, high-speed
transmission and positioning, strong state error correction ability.
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about
-
AR6000
$54,798.00Add to cart6-8 inch single axle semi-automatic
Applications
It is mainly used for cutting 6-8 inch semiconductor wafers, integrated
circuits, light-emitting diodes, LED chips, solar cells, electronic
substrates, piezoelectric ceramics, etc; Suitable for materials including
silicon, quartz, alumina, iron oxide, gallium arsenide, lithium niobate,
sapphire and glass.Features
- The 8-inch equipment with outstanding floor area ratio has an effective
processing range of 8-inch wafers. - Touch teaching GUI, simulation display of editing process, simple and
convenient operation. - Precision imported ball-bearing leadscrew, linear slider, Y-direction
grating ruler closed-loop control, high-precision machine for a long
time. - Direct light and circular light sources, 70 ×— 320 × Optional
magnification double microscope, clear workpiece display. - Real time display of blade exposure, self inspection alarm of height
measurement system, vacuum early warning, and real-time controllable
processing state. - Automatic alignment, automatic cutting and automatic knife mark
detection functions reduce the workload of operators and effectively
improve production efficiency.
- The 8-inch equipment with outstanding floor area ratio has an effective
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AG6800
$45,000.00Add to cart6-8 inch fully-automatic grinding equipment
Applications
It is mainly used for fully-automatic grinding of 4-8 inch semiconductor
wafers. Suitable for specific semiconductors and other materials.Features
- In-feed grinding mode.
- Precision imported ball crew, linear slider, Z-direction precision control,
high-precision machine for a long time. - Double spindle, three working discs, high processing efficiency.
- Full-automatic loading and unloading, transmission and positioning,
cleaning and drying, realize the fully automatic operation mode, and
greatly reduce the workload of Op. - Ultra-thin thinning and stable processing.
- Good compatibility, high compatibility with other types of equipment
and key consumables on the market. - Convenient operation and human-computer interaction interface.
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AR9700
$45,788.00Add to cart12 inches + (for PKG) Double axis full-automatic cutter
Applications
It is mainly used for fully-automatic cutting processing in the fields of 15
inch integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
communication devices and so on; Suitable for various materials including
silicon, quartz glass, alumina, ceramics, PCB board or package frame.Features
- Biaxial cutting can cut larger workpieces and improve efficiency.
- Precision imported ball crew, linear slider, Y-direction grating ruler closed-loop control,
high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance between
two blades is at least 24mm. The dual axis cutting process has a wider application range. - Full-automatic loading and unloading, transmission and positioning, alignment cutting,
tool mark detection, cleaning and drying, so as to realize the full-automatic operation
mode and greatly reduce the workload of Op. - The cutting frame and worktable can be customized, and the package and wafer dual
adaptive interfaces are reserved for convenient and fast conversion. - High speed material box frame scanning, anti-collision alarm, high-speed transmission
and positioning, strong state error correction ability
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