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Model 6020
$56,000.00
Model 6020 – Large Substrate ExposureSystem for RDL Panel Level PKG or Glass Panels
- 1st level exposure prints mask on substrates
- Optional Flood Exposure
- Substrate size 20” x20” with 24”x24” mask inserts
- Lamp power 8kw
- Stand alone system or fully integrated into customer’s line
- Available with robotic handling
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Model 30
$7,800.00Add to cartModel 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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TriSOL Standard Class AAA (TSS)
$6,900.00Add to cart- Delivers highly collimated uniform light output rated 350W- 5,000W
- Available with air mass filters for a wide range of solar spectra
- Used in photobiology, biomedical, solar cell testing, cosmetic testing, and paint and coatings analysis
- Repeatable reliable constant output, & measurement uniformity
- Rotation beam output can be configured in downward, vertical, horizontal or 360 degree rotation
- Meets JIS, IES, and ASTM standards
- Optional pipe adapter for CPV
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Model 6000
$55,000.00Add to cartModel 6000 – Fully Automated Mask Aligner for High Volume Production
- Flexibility to handle wafer sizes 4” (100mm) to 12” (300mm)
- Highly optimized yields (200 wph in 1st mask mode)
- Cognix Vision Pro with customized software
- Automatic Wedge Effect Leveling
- Unlimited recipe storage
- Superb process repeatability
- Cluster tool integration
- Front and backside alignment
- Accurate top to bottom auto alignment
- Optional UV LED upgrade
- Optional SECS/GEM Interface upgrade
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AML Wafer Bonder – Activate, Align and Bond all in one system
$76,800.00Original price was: $76,800.00.$46,500.00Current price is: $46,500.00.Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface -
Model 200
$6,800.00Add to cartModel 200 – Tabletop Contact Mask Aligner
- Flexible with easy change of substrates and masks
- Substrates can be small with pieces up to 8”
- High quality printing resolution
- Available with near, mid, and deep UV
Options:
- UV LED Lightsource
- IR Backside Alignment
- Nano Imprint Module
- Vibration Isolation Table
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