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Model 6020
$56,000.00
Model 6020 – Large Substrate ExposureSystem for RDL Panel Level PKG or Glass Panels
- 1st level exposure prints mask on substrates
- Optional Flood Exposure
- Substrate size 20” x20” with 24”x24” mask inserts
- Lamp power 8kw
- Stand alone system or fully integrated into customer’s line
- Available with robotic handling
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TriSOL Standard Class AAA (TSS)
$6,900.00Add to cart- Delivers highly collimated uniform light output rated 350W- 5,000W
- Available with air mass filters for a wide range of solar spectra
- Used in photobiology, biomedical, solar cell testing, cosmetic testing, and paint and coatings analysis
- Repeatable reliable constant output, & measurement uniformity
- Rotation beam output can be configured in downward, vertical, horizontal or 360 degree rotation
- Meets JIS, IES, and ASTM standards
- Optional pipe adapter for CPV
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Model 2012
$56,700.00Add to cartModel 2012 – 300mm Optical Edge or Flood Exposure System
• Handles 200 or 300mm wafers (8” -12”)
• Has automated foup loading or cassette to cassette handling
• Up to 8kw Collimated Beam Light Source
• Bar code reader and remote diagnostic
• Semi safety compliant
• Windows graphic user interface
• Remote diagnostics -
Hast
$45,000.00Add to cartThe Standard design is safer,
and the inner arc design
prevents condensation and
dripping, which complies with
national safety container
regulations
• Multiple protection functions, two
high-temperature protection
devices, humidity water cutoff
protection, and overpressure
protection
• Higher stability: equipped with
self-developed PIO control
algorithm.ensuring the accuracy
of temperature,humidity and
pressure values
• Humidity free selection:
saturation and unsaturation free
setting
• High intelligence: USB data,
curve export and save function -
Model 2000
$48,000.00Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
- Optional SECS/GEM upgrade
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AML Wafer Bonder – Activate, Align and Bond all in one system
Original price was: $76,800.00.$46,500.00Current price is: $46,500.00.Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface
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