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TEL Magnetic Annealing System
Technical Specifications
• Magnetic field: 0 to 8.0 Tesla
• Wafer size: Ø2” (51 mm) circular diameter & 5 product wafers
• Wafer orientation: In plane or perpendicular to magnetic field direction
• Field homogeneity: -2/+2% over product wafers
• Field uniformity: Angle <+/-1.5° over product wafers
• Set-point accuracy: <5 mTesla
• Field stability: <0.1% of field value
• Field reproducibility: <5 mTesla
• Temperature range: 200 – 450°C
• Max wafer exit temp: 60°C
• Thermal uniformity: < ±3°C in sample volume
• Set point accuracy: ±1.5°C
• Cross wafer uniformity: ±2°C
• Cross stack uniformity: ±1.5°C
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