UV-Litho-Y

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  Model 2000

  $48,000.00

  Model 2000 – Flood or Optical Edge Exposure System

  • Handles wafer sizes up to 8 inches
  • Windows based graphic user interface
  • Cassette-to-cassette robotic handling
  • Stores and logs process data
  • Remote diagnostics feature
  • High efficiency automated production system available with near, mid, and deep UV exposure
  • Highly stable and precise Intensity Controlling Power Supply
  • Optional UV LED upgrade
  • Optional SECS/GEM upgrade

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  UV Litho S+

  $5,622.00

  • Minimum Line width:    0.5 um
  • Minimum Feature size: 0.35 um
  • Writing Speed: 300 mm²/min @ 0.5 um
  • 3,000mm2/min @ 5.0 um
  • Light source: LD 405nm / 375nm
  • XY distance:  55mm
  • Overlay Accuracy: 200nm
  • Minimum sample size: 1 inch x 1 inch
  • Maximum sample size: 8 inch x 8 inch

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  AR8200

  $47,000.00

  AR8200 – Fully Automatic Dicing Saw

  Applications

  It is mainly used for fully-automatic cutting processing in the fields of multi chip QFN, DFN,
  BGA, led-pcb frame, optical communication devices and so on; It is suitable for a variety of
  materials including quartz glass, alumina, ceramics, PCB board or package frame.

  Features

  • Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
    higher than that of single machine.
  • Precision imported ball-bearing leadscrew, linear slider, Y-direction grating ruler
    closed-loop control, high-precision machine for a long time.
  • The main shaft is equipped with a gantry worktable structure, and the distance between
    two knives is at least 24mm. The dual axis cutting process has a wider application range.
  • Fully automatic loading and unloading, automatic transmission and positioning,
    automatic alignment cutting and automatic tool mark detection reduce the workload of
    OP and realize the replacement of machines to a greater extent.
  • Special cutting frame and worktable can be customized, and multiple pieces of double
    knives can be cut efficiently.
  • Direct light and ring light sources, 70 ×—320 × Optional magnification double
    microscope, wide process application range.
  • Touch teaching GUI, simulation display of editing process, multichip wafer pre cutting
    mode, simple and convenient program editing.

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  Model 212

  $5,600.00

  Model 212 – Tabletop Mask Aligner for substrates up to 300mm

  • Designed for substrates up to 12” (300 x300 mm)
  • Precision alignment
  • Low cost R&D tool for large area substrates
  • Used for pkg, displays and 300mm wafers

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  AR9200

  $45,880.00

  Jig saw cutting and sorting integrated machine | Double axis double station fully automatic

  Applications

  It is mainly used for cutting packaging products, such as DFN, QFN, BGA
  and other sealed products.

  Features

  • Dual axis efficient cutting mode, independent vision system can ensure
    alignment and cutting at the same time, which can improve cutting efficiency.
  • Double working platforms work circularly, making full use of various structures
    of the equipment, which can improve the cutting efficiency.
  • Special jig , high vacuum adsorption substrate, no film sticking, reducing the
    process flow and related costs of film sticking and dispergation.
  • It can be equipped with full-automatic feeding, transmission positioning,
    alignment cutting, tool mark detection, cleaning and drying, so as to realize
    the full-automatic operation mode and greatly reduce the labor cost.
  • Equipped with fully-automatic slag removal and collection structure to reduce
    the cost of human maintenance.
  • The cutting and conversion of different products is fast, which can be
    completed by replacing the customized jig.

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