UV-Litho-Y

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  Model 2000

  $48,000.00

  Model 2000 – Flood or Optical Edge Exposure System

  • Handles wafer sizes up to 8 inches
  • Windows based graphic user interface
  • Cassette-to-cassette robotic handling
  • Stores and logs process data
  • Remote diagnostics feature
  • High efficiency automated production system available with near, mid, and deep UV exposure
  • Highly stable and precise Intensity Controlling Power Supply
  • Optional UV LED upgrade
  • Optional SECS/GEM upgrade

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  AR9200

  $45,880.00

  Jig saw cutting and sorting integrated machine | Double axis double station fully automatic

  Applications

  It is mainly used for cutting packaging products, such as DFN, QFN, BGA
  and other sealed products.

  Features

  • Dual axis efficient cutting mode, independent vision system can ensure
    alignment and cutting at the same time, which can improve cutting efficiency.
  • Double working platforms work circularly, making full use of various structures
    of the equipment, which can improve the cutting efficiency.
  • Special jig , high vacuum adsorption substrate, no film sticking, reducing the
    process flow and related costs of film sticking and dispergation.
  • It can be equipped with full-automatic feeding, transmission positioning,
    alignment cutting, tool mark detection, cleaning and drying, so as to realize
    the full-automatic operation mode and greatly reduce the labor cost.
  • Equipped with fully-automatic slag removal and collection structure to reduce
    the cost of human maintenance.
  • The cutting and conversion of different products is fast, which can be
    completed by replacing the customized jig.

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  Model 6000A

  $67,350.00

  Model 6000A-MA Integrated Production Systems- Mask Aligner with Mask Changer

  • Includes all the advanced features of the Model 6000
  • Reads and verifies the right mask for process stored in the Model 6000 recipes
  • Remote diagnosis feature
  • Improves thruput in lithography processing
  • Prints multiple structures on the same level of a biochip

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  Model 6000

  $55,000.00

  Model 6000 – Fully Automated Mask Aligner for High Volume Production

  • Flexibility to handle wafer sizes 4” (100mm) to 12” (300mm)
  • Highly optimized yields (200 wph in 1st mask mode)
  • Cognix Vision Pro with customized software
  • Automatic Wedge Effect Leveling
  • Unlimited recipe storage
  • Superb process repeatability
  • Cluster tool integration
  • Front and backside alignment
  • Accurate top to bottom auto alignment
  • Optional UV LED upgrade
  • Optional SECS/GEM Interface upgrade

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  AR9000

  $54,800.00

  12 inch double axis fully-automatic

  Applications

  It is mainly used for fully-automatic cutting processing in 8-12 inch semiconductor
  wafer, integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
  communication devices and other fields; Suitable for various materials including silicon,
  quartz glass, alumina, ceramics, PCB board or package frame.

  Features

  • Optimize the double axis high-efficiency cutting mode, and the efficiency is about
    80% higher than that of single machine.
  • Precision imported ball screw, linear slider, Y-direction grating ruler closed-loop
    control, high-precision machine for a long time.
  • The main shaft is equipped with a gantry worktable structure, and the distance
    between two blades is at least 24mm. The dual axis cutting process has a wider
    application range.
  • Fully automatic loading and unloading, transmission and positioning, alignment
    cutting, tool mark detection, cleaning and drying, so as to realize the fully
    automatic operation mode and greatly reduce the workload of Op.
  • The cutting frame and worktable can be customized, and the package and wafer
    dual adaptive interfaces are reserved for convenient and fast conversion.
  • High speed material box frame scanning, anti-collision alarm, high-speed
    transmission and positioning, strong state error correction ability.

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