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Model 212
Model 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
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Model 32
Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
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Model 30
Add to cartModel 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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Ultra High Temperature Oven (+400/+500/+600C)
Add to cartManufactured with high quality stainless steel for easy maintenance and excellent durability. Using a unique double walled stainless steel interior with direct heating system available in temperature ranges to +400°C, +500°C and +600°C. The high grade +1200°C insulation on all surfaces keeps the exterior cool whilst at maximum operating temperature. Available in gravity convection or …
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UV-Litho-Y
Add to cart- Minimum Line width: 1.5um
- Minimum Feature size: 1.2um
- Writing Speed: 10 mm2/min @ 1.5um
- Light source: LED 405nm / 385nm
- XY distance: 55mm
- Overlay Accuracy: 500nm
- Minimum sample size: 3mm x 3mm
- Maximum sample size: 50mm x 50 mm
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AML Wafer Bonder – Activate, Align and Bond all in one system
Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface
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