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Model 30
$7,800.00
Model 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV
- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
Related products
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Model 2000
$48,000.00Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
- Optional SECS/GEM upgrade
-
AR9000
$54,800.00Add to cart12 inch double axis fully-automatic
Applications
It is mainly used for fully-automatic cutting processing in 8-12 inch semiconductor
wafer, integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
communication devices and other fields; Suitable for various materials including silicon,
quartz glass, alumina, ceramics, PCB board or package frame.Features
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about
80% higher than that of single machine. - Precision imported ball screw, linear slider, Y-direction grating ruler closed-loop
control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance
between two blades is at least 24mm. The dual axis cutting process has a wider
application range. - Fully automatic loading and unloading, transmission and positioning, alignment
cutting, tool mark detection, cleaning and drying, so as to realize the fully
automatic operation mode and greatly reduce the workload of Op. - The cutting frame and worktable can be customized, and the package and wafer
dual adaptive interfaces are reserved for convenient and fast conversion. - High speed material box frame scanning, anti-collision alarm, high-speed
transmission and positioning, strong state error correction ability.
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about
-
TS580
$56,895.00Add to cart- Temperature change rate is fast, -55 0C toThe conversion between+ 1 25 0C is about 1 0 seconds
- Temperature range of-80 0 C to +225 0 C
- Compact and mobile design
- Touch screen operation, human-computer interaction interface
- Fast DUT temperature stabilization time
- Temperature control accuracy ± 1 oc, display accuracy ± 0.1 oc
- Air up to 18 SCFM
- Defrosting design, rapid removal of internal water vapor accumulation
-
Hast
$45,000.00Add to cartThe Standard design is safer,
and the inner arc design
prevents condensation and
dripping, which complies with
national safety container
regulations
• Multiple protection functions, two
high-temperature protection
devices, humidity water cutoff
protection, and overpressure
protection
• Higher stability: equipped with
self-developed PIO control
algorithm.ensuring the accuracy
of temperature,humidity and
pressure values
• Humidity free selection:
saturation and unsaturation free
setting
• High intelligence: USB data,
curve export and save function -
Model 212
$5,600.00Add to cartModel 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
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