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Model 6000A
$67,350.00
Model 6000A-MA Integrated Production Systems- Mask Aligner with Mask Changer
- Includes all the advanced features of the Model 6000
- Reads and verifies the right mask for process stored in the Model 6000 recipes
- Remote diagnosis feature
- Improves thruput in lithography processing
- Prints multiple structures on the same level of a biochip
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Model 6000
$55,000.00Add to cartModel 6000 – Fully Automated Mask Aligner for High Volume Production
- Flexibility to handle wafer sizes 4” (100mm) to 12” (300mm)
- Highly optimized yields (200 wph in 1st mask mode)
- Cognix Vision Pro with customized software
- Automatic Wedge Effect Leveling
- Unlimited recipe storage
- Superb process repeatability
- Cluster tool integration
- Front and backside alignment
- Accurate top to bottom auto alignment
- Optional UV LED upgrade
- Optional SECS/GEM Interface upgrade
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Model 32
$7,900.00Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
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Model 212
$5,600.00Add to cartModel 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
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UV-Litho-ACA
$550.00Add to cart- Minimum Line width: 1.0um
- Minimum Feature size: 0.8 um
- Writing Speed: 3 mm2/min @ 1um
- 20mm2/min @ 1.5um
- Light source: LED 405nm / 385nm
- XY distance: 55mm
- Overlay Accuracy: 350nm
- minimum sample size: 3mm x 3mm
- Maximum sample size: 150mm x 150 mm
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AML Wafer Bonder – Activate, Align and Bond all in one system
$46,500.00Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface
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