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AR6000
$54,798.00
6-8 inch single axle semi-automatic
Applications
It is mainly used for cutting 6-8 inch semiconductor wafers, integrated
circuits, light-emitting diodes, LED chips, solar cells, electronic
substrates, piezoelectric ceramics, etc; Suitable for materials including
silicon, quartz, alumina, iron oxide, gallium arsenide, lithium niobate,
sapphire and glass.
Features
- The 8-inch equipment with outstanding floor area ratio has an effective
processing range of 8-inch wafers. - Touch teaching GUI, simulation display of editing process, simple and
convenient operation. - Precision imported ball-bearing leadscrew, linear slider, Y-direction
grating ruler closed-loop control, high-precision machine for a long
time. - Direct light and circular light sources, 70 ×— 320 × Optional
magnification double microscope, clear workpiece display. - Real time display of blade exposure, self inspection alarm of height
measurement system, vacuum early warning, and real-time controllable
processing state. - Automatic alignment, automatic cutting and automatic knife mark
detection functions reduce the workload of operators and effectively
improve production efficiency.
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AR9700
$45,788.00Add to cart12 inches + (for PKG) Double axis full-automatic cutter
Applications
It is mainly used for fully-automatic cutting processing in the fields of 15
inch integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
communication devices and so on; Suitable for various materials including
silicon, quartz glass, alumina, ceramics, PCB board or package frame.Features
- Biaxial cutting can cut larger workpieces and improve efficiency.
- Precision imported ball crew, linear slider, Y-direction grating ruler closed-loop control,
high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance between
two blades is at least 24mm. The dual axis cutting process has a wider application range. - Full-automatic loading and unloading, transmission and positioning, alignment cutting,
tool mark detection, cleaning and drying, so as to realize the full-automatic operation
mode and greatly reduce the workload of Op. - The cutting frame and worktable can be customized, and the package and wafer dual
adaptive interfaces are reserved for convenient and fast conversion. - High speed material box frame scanning, anti-collision alarm, high-speed transmission
and positioning, strong state error correction ability
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AR8100
$41,000.00Add to cart20 inch double axle semi-automatic
Applications
It is mainly used for cutting processing in QFN, DFN, BGA, multi chip led-pcb frame,
optical communication devices and other fields; Suitable for various materials
including silicon, quartz glass, alumina, ceramics, PCB board or package frame.Features
- Optimize the double axis high-efficiency cutting mode, and the
efficiency is about 80% higher than that of single machine. - Precision imported ball crew, linear slider, Y-direction grating ruler
closed-loop control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the
distance between two blades is at least 24mm. The dual axis cutting
process has a wider application range. - Special cutting frame and worktable can be customized, and multiple
pieces of double blades can be cut efficiently. - Touch teaching GUI, simulation display of editing process, multi slice
pre cutting mode, simple and convenient program editing. - Automatic alignment, automatic cutting and automatic tool mark
detection functions reduce the workload of operators and effectively
improve production efficiency.
- Optimize the double axis high-efficiency cutting mode, and the
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AR9000RR
$75,900.00Add to cartFull-automatic ring cutting equipment Ring cutting + fully-automatic wafer-ring removal
Applications
It is mainly used for fully-automatic outer ring removal of semiconductor wafers
under Taiko process. Suitable for specific semiconductors and other materials.Features
- Multi axis linkage ring cutting technology to ensure ring cutting accuracy.
- Customized workbench design ensures stable processing of special wafer
structure under Taiko process. - Four stations, multi piece coordinated processing, high processing efficiency.
- Full- automatic loading and unloading, transmission and positioning, cleaning,
degumming and ring removal realize the full-automatic operation mode and
greatly reduce the workload of Op. - Stable Taiko outer ring degumming and ring removal.
- Good compatibility, high compatibility with other types of equipment and key
consumables on the market. - Convenient operation and human-computer interaction interface
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AG6800
$45,000.00Add to cart6-8 inch fully-automatic grinding equipment
Applications
It is mainly used for fully-automatic grinding of 4-8 inch semiconductor
wafers. Suitable for specific semiconductors and other materials.Features
- In-feed grinding mode.
- Precision imported ball crew, linear slider, Z-direction precision control,
high-precision machine for a long time. - Double spindle, three working discs, high processing efficiency.
- Full-automatic loading and unloading, transmission and positioning,
cleaning and drying, realize the fully automatic operation mode, and
greatly reduce the workload of Op. - Ultra-thin thinning and stable processing.
- Good compatibility, high compatibility with other types of equipment
and key consumables on the market. - Convenient operation and human-computer interaction interface.
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AR8000
$75,440.00Add to cart12 inch semi-automatic
Applications
It is mainly used for cutting 8-12 inch semiconductor wafer, integrated circuit,
QFN, DFN, BGA, multi chip led-pcb frame, optical communication devices and
other fields; Suitable for various materials including silicon, quartz glass, alumina,
ceramics, PCB board or package frame.Features
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
higher than that of single machine. - Precision imported ball-bearing leadscrew, linear slider, Y-direction grating ruler closed loop control, high-precision machine for a long time.
- The main shaft is equipped with a gantry worktable structure, and the distance between twoknives is at least 24mm. The dual axis cutting process has a wider application range.
- Special cutting frame and worktable can be customized, and multiple pieces of double
knives can be cut efficiently. - Optional magnification double microscope vision system, wide process adaptability.
- Touch teaching GUI, simulation display of editing process, multi slice pre cutting mode,
simple and convenient program editing. - Automatic alignment, automatic cutting and automatic knife mark detection functions
reduce the workload of operators and effectively improve production efficiency.
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
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