Only logged in customers who have purchased this product may leave a review.
AR8100
$41,000.00
20 inch double axle semi-automatic
Applications
It is mainly used for cutting processing in QFN, DFN, BGA, multi chip led-pcb frame,
optical communication devices and other fields; Suitable for various materials
including silicon, quartz glass, alumina, ceramics, PCB board or package frame.
Features
- Optimize the double axis high-efficiency cutting mode, and the
efficiency is about 80% higher than that of single machine. - Precision imported ball crew, linear slider, Y-direction grating ruler
closed-loop control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the
distance between two blades is at least 24mm. The dual axis cutting
process has a wider application range. - Special cutting frame and worktable can be customized, and multiple
pieces of double blades can be cut efficiently. - Touch teaching GUI, simulation display of editing process, multi slice
pre cutting mode, simple and convenient program editing. - Automatic alignment, automatic cutting and automatic tool mark
detection functions reduce the workload of operators and effectively
improve production efficiency.
Related products
-
UV-Litho-Y
$6,400.00Add to cart- Minimum Line width: 1.5um
- Minimum Feature size: 1.2um
- Writing Speed: 10 mm2/min @ 1.5um
- Light source: LED 405nm / 385nm
- XY distance: 55mm
- Overlay Accuracy: 500nm
- Minimum sample size: 3mm x 3mm
- Maximum sample size: 50mm x 50 mm
-
Model 6000A
$67,350.00Add to cartModel 6000A-MA Integrated Production Systems- Mask Aligner with Mask Changer
- Includes all the advanced features of the Model 6000
- Reads and verifies the right mask for process stored in the Model 6000 recipes
- Remote diagnosis feature
- Improves thruput in lithography processing
- Prints multiple structures on the same level of a biochip
-
AR9000RR
$75,900.00Add to cartFull-automatic ring cutting equipment Ring cutting + fully-automatic wafer-ring removal
Applications
It is mainly used for fully-automatic outer ring removal of semiconductor wafers
under Taiko process. Suitable for specific semiconductors and other materials.Features
- Multi axis linkage ring cutting technology to ensure ring cutting accuracy.
- Customized workbench design ensures stable processing of special wafer
structure under Taiko process. - Four stations, multi piece coordinated processing, high processing efficiency.
- Full- automatic loading and unloading, transmission and positioning, cleaning,
degumming and ring removal realize the full-automatic operation mode and
greatly reduce the workload of Op. - Stable Taiko outer ring degumming and ring removal.
- Good compatibility, high compatibility with other types of equipment and key
consumables on the market. - Convenient operation and human-computer interaction interface
-
Model 6000
$55,000.00Add to cartModel 6000 – Fully Automated Mask Aligner for High Volume Production
- Flexibility to handle wafer sizes 4” (100mm) to 12” (300mm)
- Highly optimized yields (200 wph in 1st mask mode)
- Cognix Vision Pro with customized software
- Automatic Wedge Effect Leveling
- Unlimited recipe storage
- Superb process repeatability
- Cluster tool integration
- Front and backside alignment
- Accurate top to bottom auto alignment
- Optional UV LED upgrade
- Optional SECS/GEM Interface upgrade
-
ATC860
$6,485.00Add to cart• Temperature range of -70°C to +200°C
• Temperature stability ± 0.5 °C
• Touch screen operation, human-computer interaction interface
• Support OUT control
• Desktop design, low noise, low vibration, and low environmental heat dissipation
• Low temperature fluctuations
• Low temperature environment testing without condensation
Reviews
There are no reviews yet.