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AR8200
$47,000.00
AR8200 – Fully Automatic Dicing Saw
Applications
It is mainly used for fully-automatic cutting processing in the fields of multi chip QFN, DFN,
BGA, led-pcb frame, optical communication devices and so on; It is suitable for a variety of
materials including quartz glass, alumina, ceramics, PCB board or package frame.
Features
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
higher than that of single machine. - Precision imported ball-bearing leadscrew, linear slider, Y-direction grating ruler
closed-loop control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance between
two knives is at least 24mm. The dual axis cutting process has a wider application range. - Fully automatic loading and unloading, automatic transmission and positioning,
automatic alignment cutting and automatic tool mark detection reduce the workload of
OP and realize the replacement of machines to a greater extent. - Special cutting frame and worktable can be customized, and multiple pieces of double
knives can be cut efficiently. - Direct light and ring light sources, 70 ×—320 × Optional magnification double
microscope, wide process application range. - Touch teaching GUI, simulation display of editing process, multichip wafer pre cutting
mode, simple and convenient program editing.
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AR9200
$45,880.00Add to cartJig saw cutting and sorting integrated machine | Double axis double station fully automatic
Applications
It is mainly used for cutting packaging products, such as DFN, QFN, BGA
and other sealed products.Features
- Dual axis efficient cutting mode, independent vision system can ensure
alignment and cutting at the same time, which can improve cutting efficiency. - Double working platforms work circularly, making full use of various structures
of the equipment, which can improve the cutting efficiency. - Special jig , high vacuum adsorption substrate, no film sticking, reducing the
process flow and related costs of film sticking and dispergation. - It can be equipped with full-automatic feeding, transmission positioning,
alignment cutting, tool mark detection, cleaning and drying, so as to realize
the full-automatic operation mode and greatly reduce the labor cost. - Equipped with fully-automatic slag removal and collection structure to reduce
the cost of human maintenance. - The cutting and conversion of different products is fast, which can be
completed by replacing the customized jig.
- Dual axis efficient cutting mode, independent vision system can ensure
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AML Wafer Bonder – Activate, Align and Bond all in one system
$46,500.00Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface -
I-V Testing System
$8,900.00Add to cart- Standalone or integrated with the OAI I-V Measurement System
- I-V Test Systems: Standalone or fully Integrated with any OAI Solar Simulator
- Extremely accurate measurements of solar cell I-V
- Parameters & efficiency
- Propritary IV Rider Software measuring critical I-V Parameters
- Standard ranges of I-V testers are: S1a, 1-5A, and 20A – verified at Fraunhofer, ISE, & NREL.
- Multiplexing function to test various solar cells
- Measures up to +/- 35A/ +/-10V/350w I-V RANGE
- Features corrected I-V curves & Graphical/ Tabular QC monitoring
- Optional Normalization Kit to correct any lamp instability
-
AR9000RR
$75,900.00Add to cartFull-automatic ring cutting equipment Ring cutting + fully-automatic wafer-ring removal
Applications
It is mainly used for fully-automatic outer ring removal of semiconductor wafers
under Taiko process. Suitable for specific semiconductors and other materials.Features
- Multi axis linkage ring cutting technology to ensure ring cutting accuracy.
- Customized workbench design ensures stable processing of special wafer
structure under Taiko process. - Four stations, multi piece coordinated processing, high processing efficiency.
- Full- automatic loading and unloading, transmission and positioning, cleaning,
degumming and ring removal realize the full-automatic operation mode and
greatly reduce the workload of Op. - Stable Taiko outer ring degumming and ring removal.
- Good compatibility, high compatibility with other types of equipment and key
consumables on the market. - Convenient operation and human-computer interaction interface
-
Model 800E
$87,990.00Add to cartModel 800E – Semi-Automated Mask Aligner for Front or Backside Mask Alignment
- 3-point automatic wafer leveling
- Windows 10 operating system with unlimited recipe storage
- Remote diagnostics
- Motorized joy stick: allows fast mode to target and precise mode for precision alignment
- One touch from standard view to wide angle view with
- no resolution loss
- IR lamp kit available
- Optional UV LED upgrade
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