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Model 200
$6,800.00
Model 200 – Tabletop Contact Mask Aligner
- Flexible with easy change of substrates and masks
- Substrates can be small with pieces up to 8”
- High quality printing resolution
- Available with near, mid, and deep UV
Options:
- UV LED Lightsource
- IR Backside Alignment
- Nano Imprint Module
- Vibration Isolation Table
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TriSOL Standard Class AAA (TSS)
$6,900.00Add to cart- Delivers highly collimated uniform light output rated 350W- 5,000W
- Available with air mass filters for a wide range of solar spectra
- Used in photobiology, biomedical, solar cell testing, cosmetic testing, and paint and coatings analysis
- Repeatable reliable constant output, & measurement uniformity
- Rotation beam output can be configured in downward, vertical, horizontal or 360 degree rotation
- Meets JIS, IES, and ASTM standards
- Optional pipe adapter for CPV
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Model 32
$7,900.00Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
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Model 30
$7,800.00Add to cartModel 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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AR9000RR
$75,900.00Add to cartFull-automatic ring cutting equipment Ring cutting + fully-automatic wafer-ring removal
Applications
It is mainly used for fully-automatic outer ring removal of semiconductor wafers
under Taiko process. Suitable for specific semiconductors and other materials.Features
- Multi axis linkage ring cutting technology to ensure ring cutting accuracy.
- Customized workbench design ensures stable processing of special wafer
structure under Taiko process. - Four stations, multi piece coordinated processing, high processing efficiency.
- Full- automatic loading and unloading, transmission and positioning, cleaning,
degumming and ring removal realize the full-automatic operation mode and
greatly reduce the workload of Op. - Stable Taiko outer ring degumming and ring removal.
- Good compatibility, high compatibility with other types of equipment and key
consumables on the market. - Convenient operation and human-computer interaction interface
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Model 2000
$48,000.00Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
- Optional SECS/GEM upgrade
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