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  AR9000RR

  $75,900.00

  Full-automatic ring cutting equipment Ring cutting + fully-automatic wafer-ring removal

  Applications

  It is mainly used for fully-automatic outer ring removal of semiconductor wafers
  under Taiko process. Suitable for specific semiconductors and other materials.

  Features

  • Multi axis linkage ring cutting technology to ensure ring cutting accuracy.
  • Customized workbench design ensures stable processing of special wafer
    structure under Taiko process.
  • Four stations, multi piece coordinated processing, high processing efficiency.
  • Full- automatic loading and unloading, transmission and positioning, cleaning,
    degumming and ring removal realize the full-automatic operation mode and
    greatly reduce the workload of Op.
  • Stable Taiko outer ring degumming and ring removal.
  • Good compatibility, high compatibility with other types of equipment and key
    consumables on the market.
  • Convenient operation and human-computer interaction interface

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