Cart

Your Cart is Empty

Back To Shop
Sale!

AML Wafer Bonder – Activate, Align and Bond all in one system

$46,500.00

• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface

Reviews

There are no reviews yet.

Only logged in customers who have purchased this product may leave a review.

Cart

Your Cart is Empty

Back To Shop