AR8000

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  AR3000

  $38,645.00

  4-6 inch single axle semi-automatic

  Applications

  It is mainly used for cutting 6-inch semiconductor wafers, integrated circuits,
  QFN, light-emitting diodes, LED chips, solar cells, electronic substrates,
  piezoelectric ceramics, etc; Suitable for materials including silicon, quartz,
  alumina, iron oxide, gallium arsenide, lithium niobate, sapphire and glass.

  Features

  • Touch teaching GUI, simulation display of editing process, simple and
    convenient operation.
  • Precision imported ball-bearing leadscrew, linear slider, Y-direction
    grating ruler closed-loop control, high-precision machine for a long
    time.
  • Direct light and circular light sources, 70 ×— 320 × Optional
    magnification double microscope, the workpiece is clearly displayed.
  • Real time display of blade exposure, self inspection alarm of height
    measurement system, vacuum early warning, and real-time
    controllable processing state.
  • Automatic alignment, automatic cutting and automatic tool mark
    detection functions reduce the workload of operators and effectively
    improve production efficiency.

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  AG6800

  $45,000.00

  6-8 inch fully-automatic grinding equipment

  Applications

  It is mainly used for fully-automatic grinding of 4-8 inch semiconductor
  wafers. Suitable for specific semiconductors and other materials.

  Features

  • In-feed grinding mode.
  • Precision imported ball crew, linear slider, Z-direction precision control,
    high-precision machine for a long time.
  • Double spindle, three working discs, high processing efficiency.
  • Full-automatic loading and unloading, transmission and positioning,
    cleaning and drying, realize the fully automatic operation mode, and
    greatly reduce the workload of Op.
  • Ultra-thin thinning and stable processing.
  • Good compatibility, high compatibility with other types of equipment
    and key consumables on the market.
  • Convenient operation and human-computer interaction interface.

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  AR6000

  $54,798.00

  6-8 inch single axle semi-automatic

  Applications

  It is mainly used for cutting 6-8 inch semiconductor wafers, integrated
  circuits, light-emitting diodes, LED chips, solar cells, electronic
  substrates, piezoelectric ceramics, etc; Suitable for materials including
  silicon, quartz, alumina, iron oxide, gallium arsenide, lithium niobate,
  sapphire and glass.

  Features

  • The 8-inch equipment with outstanding floor area ratio has an effective
    processing range of 8-inch wafers.
  • Touch teaching GUI, simulation display of editing process, simple and
    convenient operation.
  • Precision imported ball-bearing leadscrew, linear slider, Y-direction
    grating ruler closed-loop control, high-precision machine for a long
    time.
  • Direct light and circular light sources, 70 ×— 320 × Optional
    magnification double microscope, clear workpiece display.
  • Real time display of blade exposure, self inspection alarm of height
    measurement system, vacuum early warning, and real-time controllable
    processing state.
  • Automatic alignment, automatic cutting and automatic knife mark
    detection functions reduce the workload of operators and effectively
    improve production efficiency.

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  AR9700

  $45,788.00

  12 inches + (for PKG) Double axis full-automatic cutter

  Applications

  It is mainly used for fully-automatic cutting processing in the fields of 15
  inch integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
  communication devices and so on; Suitable for various materials including
  silicon, quartz glass, alumina, ceramics, PCB board or package frame.

  Features

  • Biaxial cutting can cut larger workpieces and improve efficiency.
  • Precision imported ball crew, linear slider, Y-direction grating ruler closed-loop control,
    high-precision machine for a long time.
  • The main shaft is equipped with a gantry worktable structure, and the distance between
    two blades is at least 24mm. The dual axis cutting process has a wider application range.
  • Full-automatic loading and unloading, transmission and positioning, alignment cutting,
    tool mark detection, cleaning and drying, so as to realize the full-automatic operation
    mode and greatly reduce the workload of Op.
  • The cutting frame and worktable can be customized, and the package and wafer dual
    adaptive interfaces are reserved for convenient and fast conversion.
  • High speed material box frame scanning, anti-collision alarm, high-speed transmission
    and positioning, strong state error correction ability

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  AR9000RR

  $75,900.00

  Full-automatic ring cutting equipment Ring cutting + fully-automatic wafer-ring removal

  Applications

  It is mainly used for fully-automatic outer ring removal of semiconductor wafers
  under Taiko process. Suitable for specific semiconductors and other materials.

  Features

  • Multi axis linkage ring cutting technology to ensure ring cutting accuracy.
  • Customized workbench design ensures stable processing of special wafer
    structure under Taiko process.
  • Four stations, multi piece coordinated processing, high processing efficiency.
  • Full- automatic loading and unloading, transmission and positioning, cleaning,
    degumming and ring removal realize the full-automatic operation mode and
    greatly reduce the workload of Op.
  • Stable Taiko outer ring degumming and ring removal.
  • Good compatibility, high compatibility with other types of equipment and key
    consumables on the market.
  • Convenient operation and human-computer interaction interface

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