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AR9000RR
$75,900.00
Full-automatic ring cutting equipment Ring cutting + fully-automatic wafer-ring removal
Applications
It is mainly used for fully-automatic outer ring removal of semiconductor wafers
under Taiko process. Suitable for specific semiconductors and other materials.
Features
- Multi axis linkage ring cutting technology to ensure ring cutting accuracy.
- Customized workbench design ensures stable processing of special wafer
structure under Taiko process. - Four stations, multi piece coordinated processing, high processing efficiency.
- Full- automatic loading and unloading, transmission and positioning, cleaning,
degumming and ring removal realize the full-automatic operation mode and
greatly reduce the workload of Op. - Stable Taiko outer ring degumming and ring removal.
- Good compatibility, high compatibility with other types of equipment and key
consumables on the market. - Convenient operation and human-computer interaction interface
Related products
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Hast
$45,000.00Add to cartThe Standard design is safer,
and the inner arc design
prevents condensation and
dripping, which complies with
national safety container
regulations
• Multiple protection functions, two
high-temperature protection
devices, humidity water cutoff
protection, and overpressure
protection
• Higher stability: equipped with
self-developed PIO control
algorithm.ensuring the accuracy
of temperature,humidity and
pressure values
• Humidity free selection:
saturation and unsaturation free
setting
• High intelligence: USB data,
curve export and save function -
Model 2000
$48,000.00Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
- Optional SECS/GEM upgrade
-
Model 212
$5,600.00Add to cartModel 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
-
Model 800E
$87,990.00Add to cartModel 800E – Semi-Automated Mask Aligner for Front or Backside Mask Alignment
- 3-point automatic wafer leveling
- Windows 10 operating system with unlimited recipe storage
- Remote diagnostics
- Motorized joy stick: allows fast mode to target and precise mode for precision alignment
- One touch from standard view to wide angle view with
- no resolution loss
- IR lamp kit available
- Optional UV LED upgrade
-
Model 32
$7,900.00Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
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