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ATC860
• Temperature range of -70°C to +200°C
• Temperature stability ± 0.5 °C
• Touch screen operation, human-computer interaction interface
• Support OUT control
• Desktop design, low noise, low vibration, and low environmental heat dissipation
• Low temperature fluctuations
• Low temperature environment testing without condensation
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AML Wafer Bonder – Activate, Align and Bond all in one system
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Model 6020
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UV-Litho-ACA
Add to cart- Minimum Line width: 1.0um
- Minimum Feature size: 0.8 um
- Writing Speed: 3 mm2/min @ 1um
- 20mm2/min @ 1.5um
- Light source: LED 405nm / 385nm
- XY distance: 55mm
- Overlay Accuracy: 350nm
- minimum sample size: 3mm x 3mm
- Maximum sample size: 150mm x 150 mm
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