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Model 200
$6,800.00
Model 200 – Tabletop Contact Mask Aligner
- Flexible with easy change of substrates and masks
- Substrates can be small with pieces up to 8”
- High quality printing resolution
- Available with near, mid, and deep UV
Options:
- UV LED Lightsource
- IR Backside Alignment
- Nano Imprint Module
- Vibration Isolation Table
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UV-Litho-Y
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AG6800
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- Precision imported ball crew, linear slider, Z-direction precision control,
high-precision machine for a long time. - Double spindle, three working discs, high processing efficiency.
- Full-automatic loading and unloading, transmission and positioning,
cleaning and drying, realize the fully automatic operation mode, and
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AR9700
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It is mainly used for fully-automatic cutting processing in the fields of 15
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communication devices and so on; Suitable for various materials including
silicon, quartz glass, alumina, ceramics, PCB board or package frame.Features
- Biaxial cutting can cut larger workpieces and improve efficiency.
- Precision imported ball crew, linear slider, Y-direction grating ruler closed-loop control,
high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance between
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mode and greatly reduce the workload of Op. - The cutting frame and worktable can be customized, and the package and wafer dual
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AML Wafer Bonder – Activate, Align and Bond all in one system
$46,500.00Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface
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