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OAI Model 200
Model 200 – Tabletop Contact Mask Aligner
- Flexible with easy change of substrates and masks
- Substrates can be small with pieces up to 8”
- High quality printing resolution
- Available with near, mid, and deep UV
Options:
- UV LED Lightsource
- IR Backside Alignment
- Nano Imprint Module
- Vibration Isolation Table
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TS580
Add to cart- Temperature change rate is fast, -55 0C toThe conversion between+ 1 25 0C is about 1 0 seconds
- Temperature range of-80 0 C to +225 0 C
- Compact and mobile design
- Touch screen operation, human-computer interaction interface
- Fast DUT temperature stabilization time
- Temperature control accuracy ± 1 oc, display accuracy ± 0.1 oc
- Air up to 18 SCFM
- Defrosting design, rapid removal of internal water vapor accumulation
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UV-Litho-Y
Add to cart- Minimum Line width: 1.5um
- Minimum Feature size: 1.2um
- Writing Speed: 10 mm2/min @ 1.5um
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- XY distance: 55mm
- Overlay Accuracy: 500nm
- Minimum sample size: 3mm x 3mm
- Maximum sample size: 50mm x 50 mm
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Model 2012
Add to cartModel 2012 – 300mm Optical Edge or Flood Exposure System
• Handles 200 or 300mm wafers (8” -12”)
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• Windows graphic user interface
• Remote diagnostics -
Model 32
Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
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Ultra High Temperature Oven (+400/+500/+600C)
Add to cartManufactured with high quality stainless steel for easy maintenance and excellent durability. Using a unique double walled stainless steel interior with direct heating system available in temperature ranges to +400°C, +500°C and +600°C. The high grade +1200°C insulation on all surfaces keeps the exterior cool whilst at maximum operating temperature. Available in gravity convection or …
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