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OAI Model 200
Model 200 – Tabletop Contact Mask Aligner
- Flexible with easy change of substrates and masks
- Substrates can be small with pieces up to 8”
- High quality printing resolution
- Available with near, mid, and deep UV
Options:
- UV LED Lightsource
- IR Backside Alignment
- Nano Imprint Module
- Vibration Isolation Table
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- Temperature control accuracy ± 1 oc, display accuracy ± 0.1 oc
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UV-Litho-ACA
Add to cart- Minimum Line width: 1.0um
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- Overlay Accuracy: 350nm
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Model 2012
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• Handles 200 or 300mm wafers (8” -12”)
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AML Wafer Bonder – Activate, Align and Bond all in one system
Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface
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