Model 212

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  AML Wafer Bonder – Activate, Align and Bond all in one system

  • In situ alignment with 1um accuracy
  • Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
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  • Available: Anodic silicon direct and thermal compression
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  • Contact and bonding with forces up to 40KN
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  UV-Litho-Y

  • Minimum Line width:     1.5um
  • Minimum Feature size: 1.2um
  • Writing Speed: 10 mm2/min @ 1.5um
  • Light source: LED 405nm / 385nm
  • XY distance:  55mm
  • Overlay Accuracy: 500nm
  • Minimum sample size: 3mm x 3mm
  • Maximum sample size: 50mm x 50 mm

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  OAI Model 200

  Model 200 – Tabletop Contact Mask Aligner

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  UV-Litho-ACA

  • Minimum Line width:    1.0um
  • Minimum Feature size: 0.8 um
  • Writing Speed: 3 mm²/min @ 1um
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  • Light source: LED 405nm / 385nm
  • XY distance:  55mm
  • Overlay Accuracy: 350nm
  • minimum sample size: 3mm x 3mm
  • Maximum sample size: 150mm x 150 mm

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  Model 2012

  Model 2012 – 300mm Optical Edge or Flood Exposure System

  • Handles 200 or 300mm wafers (8” -12”)
  • Has automated foup loading or cassette to cassette handling
  • Up to 8kw Collimated Beam Light Source
  • Bar code reader and remote diagnostic
  • Semi safety compliant
  • Windows graphic user interface
  • Remote diagnostics

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