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Model 30
Model 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV
- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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Ultra High Temperature Oven (+400/+500/+600C)
Add to cartManufactured with high quality stainless steel for easy maintenance and excellent durability. Using a unique double walled stainless steel interior with direct heating system available in temperature ranges to +400°C, +500°C and +600°C. The high grade +1200°C insulation on all surfaces keeps the exterior cool whilst at maximum operating temperature. Available in gravity convection or …
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Model 2000
Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
- Optional SECS/GEM upgrade
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OAI Model 200
Add to cartModel 200 – Tabletop Contact Mask Aligner
- Flexible with easy change of substrates and masks
- Substrates can be small with pieces up to 8”
- High quality printing resolution
- Available with near, mid, and deep UV
Options:
- UV LED Lightsource
- IR Backside Alignment
- Nano Imprint Module
- Vibration Isolation Table
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Model 6020
Add to cartModel 6020 – Large Substrate ExposureSystem for RDL Panel Level PKG or Glass Panels
- 1st level exposure prints mask on substrates
- Optional Flood Exposure
- Substrate size 20” x20” with 24”x24” mask inserts
- Lamp power 8kw
- Stand alone system or fully integrated into customer’s line
- Available with robotic handling
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Model 212
Add to cartModel 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
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