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Model 32
Model 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
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TS580
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- Temperature control accuracy ± 1 oc, display accuracy ± 0.1 oc
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Model 6020
Add to cartModel 6020 – Large Substrate ExposureSystem for RDL Panel Level PKG or Glass Panels
- 1st level exposure prints mask on substrates
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Model 800E
Add to cartModel 800E – Semi-Automated Mask Aligner for Front or Backside Mask Alignment
- 3-point automatic wafer leveling
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- One touch from standard view to wide angle view with
- no resolution loss
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Model 2012
Add to cartModel 2012 – 300mm Optical Edge or Flood Exposure System
• Handles 200 or 300mm wafers (8” -12”)
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Model 2000
Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
- Optional SECS/GEM upgrade






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