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Model 6000A
Model 6000A-MA Integrated Production Systems- Mask Aligner with Mask Changer
- Includes all the advanced features of the Model 6000
- Reads and verifies the right mask for process stored in the Model 6000 recipes
- Remote diagnosis feature
- Improves thruput in lithography processing
- Prints multiple structures on the same level of a biochip
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Model 6020
Add to cartModel 6020 – Large Substrate ExposureSystem for RDL Panel Level PKG or Glass Panels
- 1st level exposure prints mask on substrates
- Optional Flood Exposure
- Substrate size 20” x20” with 24”x24” mask inserts
- Lamp power 8kw
- Stand alone system or fully integrated into customer’s line
- Available with robotic handling
-
Model 2012
Add to cartModel 2012 – 300mm Optical Edge or Flood Exposure System
• Handles 200 or 300mm wafers (8” -12”)
• Has automated foup loading or cassette to cassette handling
• Up to 8kw Collimated Beam Light Source
• Bar code reader and remote diagnostic
• Semi safety compliant
• Windows graphic user interface
• Remote diagnostics -
Hast (Highly Accelerated Stress Test)
Add to cartThe Standard design is safer,
and the inner arc design
prevents condensation and
dripping, which complies with
national safety container
regulations
• Multiple protection functions, two
high-temperature protection
devices, humidity water cutoff
protection, and overpressure
protection
• Higher stability: equipped with
self-developed PIO control
algorithm.ensuring the accuracy
of temperature,humidity and
pressure values
• Humidity free selection:
saturation and unsaturation free
setting
• High intelligence: USB data,
curve export and save function -
AML Wafer Bonder – Activate, Align and Bond all in one system
Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface -
Model 32
Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality






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