AR8200
$47,000.00
AR8200 – Fully Automatic Dicing Saw
Applications
It is mainly used for fully-automatic cutting processing in the fields of multi chip QFN, DFN,
BGA, led-pcb frame, optical communication devices and so on; It is suitable for a variety of
materials including quartz glass, alumina, ceramics, PCB board or package frame.
Features
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
higher than that of single machine.
- Precision imported ball-bearing leadscrew, linear slider, Y-direction grating ruler
closed-loop control, high-precision machine for a long time.
- The main shaft is equipped with a gantry worktable structure, and the distance between
two knives is at least 24mm. The dual axis cutting process has a wider application range.
- Fully automatic loading and unloading, automatic transmission and positioning,
automatic alignment cutting and automatic tool mark detection reduce the workload of
OP and realize the replacement of machines to a greater extent.
- Special cutting frame and worktable can be customized, and multiple pieces of double
knives can be cut efficiently.
- Direct light and ring light sources, 70 ×—320 × Optional magnification double
microscope, wide process application range.
- Touch teaching GUI, simulation display of editing process, multichip wafer pre cutting
mode, simple and convenient program editing.
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