UV-Litho-ACA

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  UV-Litho-S

  $3,600.00

  • Minimum Line width:    1.0 um
  • Minimum Feature size: 0.8 um
  • Writing Speed: 1,200 mm²/min @ 1.0 um
  • 3,000mm²/min @  5.0 um
  • Light source: LD 405nm / 375nm
  • XY distance:  55mm
  • Overlay Accuracy: 200nm
  • Minimum sample size: 1 inch x 1 inch
  • Maximum sample size: 8 inch x 8 inch

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  Model 6000

  $55,000.00

  Model 6000 – Fully Automated Mask Aligner for High Volume Production

  • Flexibility to handle wafer sizes 4” (100mm) to 12” (300mm)
  • Highly optimized yields (200 wph in 1st mask mode)
  • Cognix Vision Pro with customized software
  • Automatic Wedge Effect Leveling
  • Unlimited recipe storage
  • Superb process repeatability
  • Cluster tool integration
  • Front and backside alignment
  • Accurate top to bottom auto alignment
  • Optional UV LED upgrade
  • Optional SECS/GEM Interface upgrade

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  AR8200

  $47,000.00

  AR8200 – Fully Automatic Dicing Saw

  Applications

  It is mainly used for fully-automatic cutting processing in the fields of multi chip QFN, DFN,
  BGA, led-pcb frame, optical communication devices and so on; It is suitable for a variety of
  materials including quartz glass, alumina, ceramics, PCB board or package frame.

  Features

  • Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
    higher than that of single machine.
  • Precision imported ball-bearing leadscrew, linear slider, Y-direction grating ruler
    closed-loop control, high-precision machine for a long time.
  • The main shaft is equipped with a gantry worktable structure, and the distance between
    two knives is at least 24mm. The dual axis cutting process has a wider application range.
  • Fully automatic loading and unloading, automatic transmission and positioning,
    automatic alignment cutting and automatic tool mark detection reduce the workload of
    OP and realize the replacement of machines to a greater extent.
  • Special cutting frame and worktable can be customized, and multiple pieces of double
    knives can be cut efficiently.
  • Direct light and ring light sources, 70 ×—320 × Optional magnification double
    microscope, wide process application range.
  • Touch teaching GUI, simulation display of editing process, multichip wafer pre cutting
    mode, simple and convenient program editing.

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  Model 2000

  $48,000.00

  Model 2000 – Flood or Optical Edge Exposure System

  • Handles wafer sizes up to 8 inches
  • Windows based graphic user interface
  • Cassette-to-cassette robotic handling
  • Stores and logs process data
  • Remote diagnostics feature
  • High efficiency automated production system available with near, mid, and deep UV exposure
  • Highly stable and precise Intensity Controlling Power Supply
  • Optional UV LED upgrade
  • Optional SECS/GEM upgrade

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  AR9000RR

  $75,900.00

  Full-automatic ring cutting equipment Ring cutting + fully-automatic wafer-ring removal

  Applications

  It is mainly used for fully-automatic outer ring removal of semiconductor wafers
  under Taiko process. Suitable for specific semiconductors and other materials.

  Features

  • Multi axis linkage ring cutting technology to ensure ring cutting accuracy.
  • Customized workbench design ensures stable processing of special wafer
    structure under Taiko process.
  • Four stations, multi piece coordinated processing, high processing efficiency.
  • Full- automatic loading and unloading, transmission and positioning, cleaning,
    degumming and ring removal realize the full-automatic operation mode and
    greatly reduce the workload of Op.
  • Stable Taiko outer ring degumming and ring removal.
  • Good compatibility, high compatibility with other types of equipment and key
    consumables on the market.
  • Convenient operation and human-computer interaction interface

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