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Model 6000
$55,000.00
Model 6000 – Fully Automated Mask Aligner for High Volume Production
- Flexibility to handle wafer sizes 4” (100mm) to 12” (300mm)
- Highly optimized yields (200 wph in 1st mask mode)
- Cognix Vision Pro with customized software
- Automatic Wedge Effect Leveling
- Unlimited recipe storage
- Superb process repeatability
- Cluster tool integration
- Front and backside alignment
- Accurate top to bottom auto alignment
- Optional UV LED upgrade
- Optional SECS/GEM Interface upgrade
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Model 30
$7,800.00Add to cartModel 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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Model 212
$5,600.00Add to cartModel 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
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AG6800
$45,000.00Add to cart6-8 inch fully-automatic grinding equipment
Applications
It is mainly used for fully-automatic grinding of 4-8 inch semiconductor
wafers. Suitable for specific semiconductors and other materials.Features
- In-feed grinding mode.
- Precision imported ball crew, linear slider, Z-direction precision control,
high-precision machine for a long time. - Double spindle, three working discs, high processing efficiency.
- Full-automatic loading and unloading, transmission and positioning,
cleaning and drying, realize the fully automatic operation mode, and
greatly reduce the workload of Op. - Ultra-thin thinning and stable processing.
- Good compatibility, high compatibility with other types of equipment
and key consumables on the market. - Convenient operation and human-computer interaction interface.
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AR9200
$45,880.00Add to cartJig saw cutting and sorting integrated machine | Double axis double station fully automatic
Applications
It is mainly used for cutting packaging products, such as DFN, QFN, BGA
and other sealed products.Features
- Dual axis efficient cutting mode, independent vision system can ensure
alignment and cutting at the same time, which can improve cutting efficiency. - Double working platforms work circularly, making full use of various structures
of the equipment, which can improve the cutting efficiency. - Special jig , high vacuum adsorption substrate, no film sticking, reducing the
process flow and related costs of film sticking and dispergation. - It can be equipped with full-automatic feeding, transmission positioning,
alignment cutting, tool mark detection, cleaning and drying, so as to realize
the full-automatic operation mode and greatly reduce the labor cost. - Equipped with fully-automatic slag removal and collection structure to reduce
the cost of human maintenance. - The cutting and conversion of different products is fast, which can be
completed by replacing the customized jig.
- Dual axis efficient cutting mode, independent vision system can ensure
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Model 200
$6,800.00Add to cartModel 200 – Tabletop Contact Mask Aligner
- Flexible with easy change of substrates and masks
- Substrates can be small with pieces up to 8”
- High quality printing resolution
- Available with near, mid, and deep UV
Options:
- UV LED Lightsource
- IR Backside Alignment
- Nano Imprint Module
- Vibration Isolation Table
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