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Model 30
$7,800.00
Model 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV
- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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Model 32
$7,900.00Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
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UV-Litho-ACA
$550.00Add to cart- Minimum Line width: 1.0um
- Minimum Feature size: 0.8 um
- Writing Speed: 3 mm2/min @ 1um
- 20mm2/min @ 1.5um
- Light source: LED 405nm / 385nm
- XY distance: 55mm
- Overlay Accuracy: 350nm
- minimum sample size: 3mm x 3mm
- Maximum sample size: 150mm x 150 mm
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Model 6000A
$67,350.00Add to cartModel 6000A-MA Integrated Production Systems- Mask Aligner with Mask Changer
- Includes all the advanced features of the Model 6000
- Reads and verifies the right mask for process stored in the Model 6000 recipes
- Remote diagnosis feature
- Improves thruput in lithography processing
- Prints multiple structures on the same level of a biochip
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AR9700
$45,788.00Add to cart12 inches + (for PKG) Double axis full-automatic cutter
Applications
It is mainly used for fully-automatic cutting processing in the fields of 15
inch integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
communication devices and so on; Suitable for various materials including
silicon, quartz glass, alumina, ceramics, PCB board or package frame.Features
- Biaxial cutting can cut larger workpieces and improve efficiency.
- Precision imported ball crew, linear slider, Y-direction grating ruler closed-loop control,
high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance between
two blades is at least 24mm. The dual axis cutting process has a wider application range. - Full-automatic loading and unloading, transmission and positioning, alignment cutting,
tool mark detection, cleaning and drying, so as to realize the full-automatic operation
mode and greatly reduce the workload of Op. - The cutting frame and worktable can be customized, and the package and wafer dual
adaptive interfaces are reserved for convenient and fast conversion. - High speed material box frame scanning, anti-collision alarm, high-speed transmission
and positioning, strong state error correction ability
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AR8100
$41,000.00Add to cart20 inch double axle semi-automatic
Applications
It is mainly used for cutting processing in QFN, DFN, BGA, multi chip led-pcb frame,
optical communication devices and other fields; Suitable for various materials
including silicon, quartz glass, alumina, ceramics, PCB board or package frame.Features
- Optimize the double axis high-efficiency cutting mode, and the
efficiency is about 80% higher than that of single machine. - Precision imported ball crew, linear slider, Y-direction grating ruler
closed-loop control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the
distance between two blades is at least 24mm. The dual axis cutting
process has a wider application range. - Special cutting frame and worktable can be customized, and multiple
pieces of double blades can be cut efficiently. - Touch teaching GUI, simulation display of editing process, multi slice
pre cutting mode, simple and convenient program editing. - Automatic alignment, automatic cutting and automatic tool mark
detection functions reduce the workload of operators and effectively
improve production efficiency.
- Optimize the double axis high-efficiency cutting mode, and the
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