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TS580
$56,895.00
- Temperature change rate is fast, -55 0C toThe conversion between+ 1 25 0C is about 1 0 seconds
- Temperature range of-80 0 C to +225 0 C
- Compact and mobile design
- Touch screen operation, human-computer interaction interface
- Fast DUT temperature stabilization time
- Temperature control accuracy ± 1 oc, display accuracy ± 0.1 oc
- Air up to 18 SCFM
- Defrosting design, rapid removal of internal water vapor accumulation
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Model 2000
$48,000.00Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
- Optional SECS/GEM upgrade
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AML Wafer Bonder – Activate, Align and Bond all in one system
$76,800.00$46,500.00Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
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Model 6000A
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- Includes all the advanced features of the Model 6000
- Reads and verifies the right mask for process stored in the Model 6000 recipes
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- Improves thruput in lithography processing
- Prints multiple structures on the same level of a biochip
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AR9700
$45,788.00Add to cart12 inches + (for PKG) Double axis full-automatic cutter
Applications
It is mainly used for fully-automatic cutting processing in the fields of 15
inch integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
communication devices and so on; Suitable for various materials including
silicon, quartz glass, alumina, ceramics, PCB board or package frame.Features
- Biaxial cutting can cut larger workpieces and improve efficiency.
- Precision imported ball crew, linear slider, Y-direction grating ruler closed-loop control,
high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance between
two blades is at least 24mm. The dual axis cutting process has a wider application range. - Full-automatic loading and unloading, transmission and positioning, alignment cutting,
tool mark detection, cleaning and drying, so as to realize the full-automatic operation
mode and greatly reduce the workload of Op. - The cutting frame and worktable can be customized, and the package and wafer dual
adaptive interfaces are reserved for convenient and fast conversion. - High speed material box frame scanning, anti-collision alarm, high-speed transmission
and positioning, strong state error correction ability
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I-V Testing System
$8,900.00Add to cart- Standalone or integrated with the OAI I-V Measurement System
- I-V Test Systems: Standalone or fully Integrated with any OAI Solar Simulator
- Extremely accurate measurements of solar cell I-V
- Parameters & efficiency
- Propritary IV Rider Software measuring critical I-V Parameters
- Standard ranges of I-V testers are: S1a, 1-5A, and 20A – verified at Fraunhofer, ISE, & NREL.
- Multiplexing function to test various solar cells
- Measures up to +/- 35A/ +/-10V/350w I-V RANGE
- Features corrected I-V curves & Graphical/ Tabular QC monitoring
- Optional Normalization Kit to correct any lamp instability
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