Category: Equipments

Equipments

Showing 1–16 of 34 results

  • AML Wafer Bonder – Activate, Align and Bond all in one system

    $46,500.00

    • In situ alignment with 1um accuracy
    • Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
    • Eliminates need for external mask aligner
    • Available: Anodic silicon direct and thermal compression
    bond tooling
    • Contact and bonding with forces up to 40KN
    • Autovapor injection
    • Wafers held in separation
    • User interface

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  • ATC860

    $6,485.00

    • Temperature range of -70°C to +200°C
    • Temperature stability ± 0.5 °C
    • Touch screen operation, human-computer interaction interface
    • Support OUT control
    • Desktop design, low noise, low vibration, and low environmental heat dissipation
    • Low temperature fluctuations
    • Low temperature environment testing without condensation

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  • CIQTEK DB500 Focused Ion Beam FESEM Microscope

    • Electron Beam System
    Gun type: High brightness Schottky Plus Field Emission Electron Gun
    Resolution: 1.2 nm@15 kV
    Acceleration Voltage 20 V ~ 30 kV
    • Ion Beam System
    Gun type: Liquid gallium ion source Resolution: 3 nm@30 kV
    Acceleration Voltage 500 V ~ 30 kV
    • Camera: Triple Optical navigation + sample chamber monitoring x2.
    • Stage Type: Eucentric stage
    • Stage Range: X=110 mm Y=110 mm / T: -10° ~+70°, Z=65 mm R: 360°

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  • CIQTEK SEM5000X FESEM Microscope

    • Resolution: 0.6 nm @ 15 kV, SE / 1.0 nm @ 1 kV, SE
    • Acceleration Voltage 0.02kV ~ 30 kV
    • Magnification 1 ~ 2,500,000 x
    • Electron Gun Type: Schottky Field Emission Electron Gun
    • Cameras: Optical navigation + Chamber monitor
    • Stage Type: 5-Axis Mechanical Eu centric
    • Stage Range: X=110 mm, Y=110 mm, Z=65 mm, T: -10*~+70°, R: 360°

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  • EMP-07A Liquid Nitrogen Generator

    • Purpose: Designed to produce liquid nitrogen (LN₂) from ambient air.
    • LN₂ Production Capacity: 8 liters per day at 60Hz; 6 liters per day at 50Hz.
    • LN₂ Storage Capacity: 40 liters.
    • Air Processing Capacity: 5.2 m³ per day.
    • Dimensions: 600 mm (W) × 750 mm (D) × 1,628 mm (H).
    • Weight: Approximately 220 kg.
    • Power Supply: 100 VAC, single-phase; power consumption of approximately 1.2 kW at 50Hz and 1.4 kW at 60Hz.
    • Cooling Method: Air-cooled; no external cooling water required.
    • Typical Applications: Vacuum evacuation devices, LN₂ cold traps, material analyzing devices, electron microscopes, EDS (EDX) detectors, and biological cryopreservation containers.
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  • GN-10i Nitrogen Gas Generator

    • Purpose: Generates nitrogen gas (N₂) with a purity of 99% (N₂ + Ar) for various industrial applications.
    • N₂ Production Rate: 10 liters per minute.
    • Discharge Pressure: 0.2 MPa.
    • Dew Point: Below -60°C.
    • Dimensions: 400 mm (W) × 460 mm (D) × 900 mm (H).
    • Weight: Approximately 60 kg.
    • Power Supply: 100 VAC, single-phase; power consumption of approximately 0.4 kW at both 50Hz and 60Hz.
    • Cooling Method: Air-cooled; no external cooling water required.
    • Typical Applications: General industrial uses requiring nitrogen gas.
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  • Hast

    $45,000.00

    The Standard design is safer,
    and the inner arc design
    prevents condensation and
    dripping, which complies with
    national safety container
    regulations
    • Multiple protection functions, two
    high-temperature protection
    devices, humidity water cutoff
    protection, and overpressure
    protection
    • Higher stability: equipped with
    self-developed PIO control
    algorithm.ensuring the accuracy
    of temperature,humidity and
    pressure values
    • Humidity free selection:
    saturation and unsaturation free
    setting
    • High intelligence: USB data,
    curve export and save function

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  • High Vacuum Systems-NANO 36

    • Thermal evaporator
    • Process Chamber Construction: 304L Stainless Steel with 6061 Aluminum
    • Magnetron Sputtering Sources: 3
    • Thermal Evaporation Sources: 4
    • Low Temperature Evaporation Sources (LTE): 4
    • Deposition Orientation: Sputter Up, Evaporation Up
    • Platen: Heating Up to 350°C / Water-Cooling
    • Substrate Size: (max) 100mm x 100mm, 150mm Dia
    • Standard Vacuum Pumping: 260 l/sec Turbo Pump

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  • High Vacuum Systems-PRO Line PVD 75

    • Process Chamber Construction: 304L Stainless Steel
    • Electron Beam Source: Multi Pocket, 5kW or 10kW Power Supplies
    • Thermal Evaporation: Up To Four, 4″ Individual Boats, Or Six 2″ Boat Assemblies
    • Substrate Size: (max) 150mm Dia
    • Standard Vacuum Pumping: Pfeiffer 790 L/s turbo molecular pump & Edwards dry pump
    • Power supplies: DC, PDC, RF, MF, and HIPIMS

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  • HPB-4B

    $39,800.00
    • Individual temperature control for each device up to 600 W
    • Test devices at a maximum temperature of 150°C with a liquid-cooled heat-sink per device
    • Programmable clocks edges with 2-nanosecond edge resolution and 8 on-the-fly timing sets
    • System capacity of 14 burn-in boards (112 devices)
    • 12 vector formats per-pin per-cycle with memory testing extensions
    • 19 programmable voltage regulators provide 2060 amps of device current per burn-in board
    • High-speed clock programmable up to 800 MHz
    • 128 I/O signals per board
    • 64M vector memory, 8G scan
    Select options This product has multiple variants. The options may be chosen on the product page
  • HPB-5C+

    $55,000.00
    • Individual temperature control for each device up to 150 W
    • Variable oven overflow control
    • Individual pattern zone per burn-in board slot
    • 32M vector memory standard, 64M optional
    • Tests devices at a temperature of up to 150°C
    • Up to 800 MHz clock rate
    • 128 digital I/O channels per burn-in board
    • System capacity of 384 devices under test with individual temperature control per device
    • 16 programmable voltage regulators with 1080 amps of device under test power per burn-in board
    • 8 high-current supplies
    • (0-4 volts at up to 125 amps each)
    • 8 low-current supplies
    • (0-6 volts at up to 10 amps each)
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  • HPB-6

    • Handle devices up to 1000 watts
    • 16 independent burn-in board slots
    • 64M standard and 128M optional parallel vector depth –subroutine capable
    • 8G scan vector depth
    • 128 formatted vector I/O channels plus 128 vector output-only channels
    • 8 programmable high-frequency clocks, up to 350 MHz – LVDS to the BiB
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  • I-V Testing System

    $8,900.00
    • Standalone or integrated with the OAI I-V Measurement System
    • I-V Test Systems: Standalone or fully Integrated with any OAI Solar Simulator
    • Extremely accurate measurements of solar cell I-V
    • Parameters & efficiency
    • Propritary IV Rider Software measuring critical I-V Parameters
    • Standard ranges of I-V testers are: S1a, 1-5A, and 20A – verified at Fraunhofer, ISE, & NREL.
    • Multiplexing function to test various solar cells
    • Measures up to +/- 35A/ +/-10V/350w I-V RANGE
    • Features corrected I-V curves & Graphical/ Tabular QC monitoring
    • Optional Normalization Kit to correct any lamp instability
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  • LC2+Burn-in Oven

    $45,000.00
    • Individual temperature control for each device up to 150 W
    • Variable oven overflow control
    • Individual pattern zone per burn-in board slot
    • 32M vector memory standard, 64M optional
    • Tests devices at a temperature of up to 150°C
    • Up to 800 MHz clock rate
    • 128 digital I/O channels per burn-in board
    • System capacity of 384 devices under test with individual temperature control per device
    • 16 programmable voltage regulators with 1080 amps of device under test power per burn-in board
    • 8 high-current supplies
    • (0-4 volts at up to 125 amps each)
    • 8 low-current supplies
    • (0-6 volts at up to 10 amps each)
    • Full Specs: https://www.microcontrol.com/high-power-burn-in-systems/lc-2/
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  • Model 200

    $6,800.00

    Model 200 – Tabletop Contact Mask Aligner

    • Flexible with easy change of substrates and masks
    • Substrates can be small with pieces up to 8”
    • High quality printing resolution
    • Available with near, mid, and deep UV

    Options:

    • UV LED Lightsource
    • IR Backside Alignment
    • Nano Imprint Module
    • Vibration Isolation Table
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  • Model 2000

    $48,000.00

    Model 2000 – Flood or Optical Edge Exposure System

    • Handles wafer sizes up to 8 inches
    • Windows based graphic user interface
    • Cassette-to-cassette robotic handling
    • Stores and logs process data
    • Remote diagnostics feature
    • High efficiency automated production system available with near, mid, and deep UV exposure
    • Highly stable and precise Intensity Controlling Power Supply
    • Optional UV LED upgrade
    • Optional SECS/GEM upgrade
    Add to cart
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