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  TEL Magnetic Annealing System

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  Technical Specifications

  • Magnetic field: 0 to 8.0 Tesla
  • Wafer size: Ø2” (51 mm) circular diameter & 5 product wafers
  • Wafer orientation: In plane or perpendicular to magnetic field direction
  • Field homogeneity: -2/+2% over product wafers
  • Field uniformity: Angle <+/-1.5° over product wafers
  • Set-point accuracy: <5 mTesla
  • Field stability: <0.1% of field value
  • Field reproducibility: <5 mTesla
  • Temperature range: 200 – 450°C
  • Max wafer exit temp: 60°C
  • Thermal uniformity: < ±3°C in sample volume
  • Set point accuracy: ±1.5°C
  • Cross wafer uniformity: ±2°C
  • Cross stack uniformity: ±1.5°C

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  Zeiss CONTURA G2 (CMM)

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  Main Features High-precision coordinate measuring machine (CMM) used in manufacturing and quality control for precise 3D measurements. · RDS Articulating Probe Head: Allows the probe to rotate in small increments (e.g., 2.5° steps) to hundreds of positions, enabling measurement of complex part features that are difficult to access without re-clamping. · VAST XXT Scanning Probe: …

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