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Model 212
Model 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
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ATC860
Add to cart• Temperature range of -70°C to +200°C
• Temperature stability ± 0.5 °C
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• Support OUT control
• Desktop design, low noise, low vibration, and low environmental heat dissipation
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UV-Litho-Y
Add to cart- Minimum Line width: 1.5um
- Minimum Feature size: 1.2um
- Writing Speed: 10 mm2/min @ 1.5um
- Light source: LED 405nm / 385nm
- XY distance: 55mm
- Overlay Accuracy: 500nm
- Minimum sample size: 3mm x 3mm
- Maximum sample size: 50mm x 50 mm
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Model 2000
Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
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Model 30
Add to cartModel 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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Model 6000
Add to cartModel 6000 – Fully Automated Mask Aligner for High Volume Production
- Flexibility to handle wafer sizes 4” (100mm) to 12” (300mm)
- Highly optimized yields (200 wph in 1st mask mode)
- Cognix Vision Pro with customized software
- Automatic Wedge Effect Leveling
- Unlimited recipe storage
- Superb process repeatability
- Cluster tool integration
- Front and backside alignment
- Accurate top to bottom auto alignment
- Optional UV LED upgrade
- Optional SECS/GEM Interface upgrade
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