Only logged in customers who have purchased this product may leave a review.
Model 212
$5,600.00
Model 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
Related products
-
Model 2000
$48,000.00Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
- Optional SECS/GEM upgrade
-
TriSOL Standard Class AAA (TSS)
$6,900.00Add to cart- Delivers highly collimated uniform light output rated 350W- 5,000W
- Available with air mass filters for a wide range of solar spectra
- Used in photobiology, biomedical, solar cell testing, cosmetic testing, and paint and coatings analysis
- Repeatable reliable constant output, & measurement uniformity
- Rotation beam output can be configured in downward, vertical, horizontal or 360 degree rotation
- Meets JIS, IES, and ASTM standards
- Optional pipe adapter for CPV
-
Model 800E
$87,990.00Add to cartModel 800E – Semi-Automated Mask Aligner for Front or Backside Mask Alignment
- 3-point automatic wafer leveling
- Windows 10 operating system with unlimited recipe storage
- Remote diagnostics
- Motorized joy stick: allows fast mode to target and precise mode for precision alignment
- One touch from standard view to wide angle view with
- no resolution loss
- IR lamp kit available
- Optional UV LED upgrade
-
AML Wafer Bonder – Activate, Align and Bond all in one system
$76,800.00Original price was: $76,800.00.$46,500.00Current price is: $46,500.00.Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface -
ATC860
$6,485.00Add to cart• Temperature range of -70°C to +200°C
• Temperature stability ± 0.5 °C
• Touch screen operation, human-computer interaction interface
• Support OUT control
• Desktop design, low noise, low vibration, and low environmental heat dissipation
• Low temperature fluctuations
• Low temperature environment testing without condensation
Reviews
There are no reviews yet.