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Model 212
Model 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
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TS580
Add to cart- Temperature change rate is fast, -55 0C toThe conversion between+ 1 25 0C is about 1 0 seconds
- Temperature range of-80 0 C to +225 0 C
- Compact and mobile design
- Touch screen operation, human-computer interaction interface
- Fast DUT temperature stabilization time
- Temperature control accuracy ± 1 oc, display accuracy ± 0.1 oc
- Air up to 18 SCFM
- Defrosting design, rapid removal of internal water vapor accumulation
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Model 2012
Add to cartModel 2012 – 300mm Optical Edge or Flood Exposure System
• Handles 200 or 300mm wafers (8” -12”)
• Has automated foup loading or cassette to cassette handling
• Up to 8kw Collimated Beam Light Source
• Bar code reader and remote diagnostic
• Semi safety compliant
• Windows graphic user interface
• Remote diagnostics -
Model 32
Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
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Model 30
Add to cartModel 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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Model 6000
Add to cartModel 6000 – Fully Automated Mask Aligner for High Volume Production
- Flexibility to handle wafer sizes 4” (100mm) to 12” (300mm)
- Highly optimized yields (200 wph in 1st mask mode)
- Cognix Vision Pro with customized software
- Automatic Wedge Effect Leveling
- Unlimited recipe storage
- Superb process repeatability
- Cluster tool integration
- Front and backside alignment
- Accurate top to bottom auto alignment
- Optional UV LED upgrade
- Optional SECS/GEM Interface upgrade






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