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Model 30
$7,800.00
Model 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV
- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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Model 6000A
$67,350.00Add to cartModel 6000A-MA Integrated Production Systems- Mask Aligner with Mask Changer
- Includes all the advanced features of the Model 6000
- Reads and verifies the right mask for process stored in the Model 6000 recipes
- Remote diagnosis feature
- Improves thruput in lithography processing
- Prints multiple structures on the same level of a biochip
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AR9000
$54,800.00Add to cart12 inch double axis fully-automatic
Applications
It is mainly used for fully-automatic cutting processing in 8-12 inch semiconductor
wafer, integrated circuit, QFN, DFN, BGA, multi chip led-pcb frame, optical
communication devices and other fields; Suitable for various materials including silicon,
quartz glass, alumina, ceramics, PCB board or package frame.Features
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about
80% higher than that of single machine. - Precision imported ball screw, linear slider, Y-direction grating ruler closed-loop
control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance
between two blades is at least 24mm. The dual axis cutting process has a wider
application range. - Fully automatic loading and unloading, transmission and positioning, alignment
cutting, tool mark detection, cleaning and drying, so as to realize the fully
automatic operation mode and greatly reduce the workload of Op. - The cutting frame and worktable can be customized, and the package and wafer
dual adaptive interfaces are reserved for convenient and fast conversion. - High speed material box frame scanning, anti-collision alarm, high-speed
transmission and positioning, strong state error correction ability.
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about
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AR8100
$41,000.00Add to cart20 inch double axle semi-automatic
Applications
It is mainly used for cutting processing in QFN, DFN, BGA, multi chip led-pcb frame,
optical communication devices and other fields; Suitable for various materials
including silicon, quartz glass, alumina, ceramics, PCB board or package frame.Features
- Optimize the double axis high-efficiency cutting mode, and the
efficiency is about 80% higher than that of single machine. - Precision imported ball crew, linear slider, Y-direction grating ruler
closed-loop control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the
distance between two blades is at least 24mm. The dual axis cutting
process has a wider application range. - Special cutting frame and worktable can be customized, and multiple
pieces of double blades can be cut efficiently. - Touch teaching GUI, simulation display of editing process, multi slice
pre cutting mode, simple and convenient program editing. - Automatic alignment, automatic cutting and automatic tool mark
detection functions reduce the workload of operators and effectively
improve production efficiency.
- Optimize the double axis high-efficiency cutting mode, and the
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AR8200
$47,000.00Add to cartAR8200 – Fully Automatic Dicing Saw
Applications
It is mainly used for fully-automatic cutting processing in the fields of multi chip QFN, DFN,
BGA, led-pcb frame, optical communication devices and so on; It is suitable for a variety of
materials including quartz glass, alumina, ceramics, PCB board or package frame.Features
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
higher than that of single machine. - Precision imported ball-bearing leadscrew, linear slider, Y-direction grating ruler
closed-loop control, high-precision machine for a long time. - The main shaft is equipped with a gantry worktable structure, and the distance between
two knives is at least 24mm. The dual axis cutting process has a wider application range. - Fully automatic loading and unloading, automatic transmission and positioning,
automatic alignment cutting and automatic tool mark detection reduce the workload of
OP and realize the replacement of machines to a greater extent. - Special cutting frame and worktable can be customized, and multiple pieces of double
knives can be cut efficiently. - Direct light and ring light sources, 70 ×—320 × Optional magnification double
microscope, wide process application range. - Touch teaching GUI, simulation display of editing process, multichip wafer pre cutting
mode, simple and convenient program editing.
- Optimize the double axis high-efficiency cutting mode, and the efficiency is about 80%
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Model 2000
$48,000.00Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
- Optional SECS/GEM upgrade
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