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Model 30
Model 30 – UV Collimated Lightsource
Standalone or integrated into any mask aligner or exposure system• Available with near, mid, or deep UV
- Mercury Arc and Mercury Xenon lamps
- Highly uniform beam at exposure plain
- Low collimation half angle
- Power up to 12.5 kw
- Pictured with optional stand
- Optional Single Level Tooling Module
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Model 2000
Add to cartModel 2000 – Flood or Optical Edge Exposure System
- Handles wafer sizes up to 8 inches
- Windows based graphic user interface
- Cassette-to-cassette robotic handling
- Stores and logs process data
- Remote diagnostics feature
- High efficiency automated production system available with near, mid, and deep UV exposure
- Highly stable and precise Intensity Controlling Power Supply
- Optional UV LED upgrade
- Optional SECS/GEM upgrade
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OAI Model 200
Add to cartModel 200 – Tabletop Contact Mask Aligner
- Flexible with easy change of substrates and masks
- Substrates can be small with pieces up to 8”
- High quality printing resolution
- Available with near, mid, and deep UV
Options:
- UV LED Lightsource
- IR Backside Alignment
- Nano Imprint Module
- Vibration Isolation Table
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I-V Testing System
Add to cart- Standalone or integrated with the OAI I-V Measurement System
- I-V Test Systems: Standalone or fully Integrated with any OAI Solar Simulator
- Extremely accurate measurements of solar cell I-V
- Parameters & efficiency
- Propritary IV Rider Software measuring critical I-V Parameters
- Standard ranges of I-V testers are: S1a, 1-5A, and 20A – verified at Fraunhofer, ISE, & NREL.
- Multiplexing function to test various solar cells
- Measures up to +/- 35A/ +/-10V/350w I-V RANGE
- Features corrected I-V curves & Graphical/ Tabular QC monitoring
- Optional Normalization Kit to correct any lamp instability
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Model 6000A
Add to cartModel 6000A-MA Integrated Production Systems- Mask Aligner with Mask Changer
- Includes all the advanced features of the Model 6000
- Reads and verifies the right mask for process stored in the Model 6000 recipes
- Remote diagnosis feature
- Improves thruput in lithography processing
- Prints multiple structures on the same level of a biochip
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AML Wafer Bonder – Activate, Align and Bond all in one system
Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface






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