Only logged in customers who have purchased this product may leave a review.
Model 6020
$56,000.00
Model 6020 – Large Substrate ExposureSystem for RDL Panel Level PKG or Glass Panels
- 1st level exposure prints mask on substrates
- Optional Flood Exposure
- Substrate size 20” x20” with 24”x24” mask inserts
- Lamp power 8kw
- Stand alone system or fully integrated into customer’s line
- Available with robotic handling
Related products
-
AG6800
$45,000.00Add to cart6-8 inch fully-automatic grinding equipment
Applications
It is mainly used for fully-automatic grinding of 4-8 inch semiconductor
wafers. Suitable for specific semiconductors and other materials.Features
- In-feed grinding mode.
- Precision imported ball crew, linear slider, Z-direction precision control,
high-precision machine for a long time. - Double spindle, three working discs, high processing efficiency.
- Full-automatic loading and unloading, transmission and positioning,
cleaning and drying, realize the fully automatic operation mode, and
greatly reduce the workload of Op. - Ultra-thin thinning and stable processing.
- Good compatibility, high compatibility with other types of equipment
and key consumables on the market. - Convenient operation and human-computer interaction interface.
-
Model 2012
$56,700.00Add to cartModel 2012 – 300mm Optical Edge or Flood Exposure System
• Handles 200 or 300mm wafers (8” -12”)
• Has automated foup loading or cassette to cassette handling
• Up to 8kw Collimated Beam Light Source
• Bar code reader and remote diagnostic
• Semi safety compliant
• Windows graphic user interface
• Remote diagnostics -
Model 32
$7,900.00Add to cartModel 32 – UV LED Collimated Lightsource
For demanding applications. Standalone or integrated intoan OAI lithography system
- Beam size 4” to 12”
- Wavelengths available: 365nm, 405nm, and 436nm
- Long life, low cost, energy efficient
- Optional single level and multilevel tooling modules
- Matches Model 30 in collimation and functionality
-
Model 212
$5,600.00Add to cartModel 212 – Tabletop Mask Aligner for substrates up to 300mm
- Designed for substrates up to 12” (300 x300 mm)
- Precision alignment
- Low cost R&D tool for large area substrates
- Used for pkg, displays and 300mm wafers
-
AML Wafer Bonder – Activate, Align and Bond all in one system
$76,800.00$46,500.00Add to cart• In situ alignment with 1um accuracy
• Used for eutectic, anodic, direct, glass fruit, thermal compression, adhesive, SLID, and custom wafer bonding.
• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
• Contact and bonding with forces up to 40KN
• Autovapor injection
• Wafers held in separation
• User interface
Reviews
There are no reviews yet.