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TS580
$56,895.00
- Temperature change rate is fast, -55 0C toThe conversion between+ 1 25 0C is about 1 0 seconds
- Temperature range of-80 0 C to +225 0 C
- Compact and mobile design
- Touch screen operation, human-computer interaction interface
- Fast DUT temperature stabilization time
- Temperature control accuracy ± 1 oc, display accuracy ± 0.1 oc
- Air up to 18 SCFM
- Defrosting design, rapid removal of internal water vapor accumulation
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AR9000
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Applications
It is mainly used for fully-automatic cutting processing in 8-12 inch semiconductor
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Model 30
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Model 2012
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AML Wafer Bonder – Activate, Align and Bond all in one system
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• Eliminates need for external mask aligner
• Available: Anodic silicon direct and thermal compression
bond tooling
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